Lead-free and cadmium-free conductive copper thick film pastes
View Patent ↗Thick film conductive copper pastes that are lead-free and cadmium-free. The inventive copper pastes possess desirable characteristics, including good solderability, good wire bondability, a low firing temperature, and a wide temperature processing window, and provide excellent adhesion to a variety of substrates, including alumina and glass coated stainless steel substrates, as well as low resistivity, and a microstructure after firing that is dense and substantially free of pores.
1. A conductive thick film paste comprising a solids portion comprising a glass component and a metal component, said glass component comprising:
a. a first glass composition comprising in mole %,
i. about 5 to about 35% ZnO,
ii. about 5 to about 40% SiO 2 , and
iii. about 2 to about 35% B 2 O 3 ,
b. a second glass composition comprising in mole %,
i. about 20 to about 70% Bi 2 O 3 ,
ii. about 20 to about 50% SiO 2 , and
iii. about 2 to about 30% B 2 O 3 ,
c. a third glass composition comprising in mole %, about 5 to about 80% Bi 2 O 3 ,
d. no lead or lead oxide, and
e. no cadmium or cadmium oxide.
2. The thick film paste of claim 1 , wherein the first glass composition further comprises about 0.1 to about 25 mol % CuO.
3. The thick film paste of claim 1 , wherein the first glass composition further comprises about 0.1 to about 10 mol % NiO.
4. The thick film paste of claim 1 , wherein the ZnO content of the second glass composition is about 10 to about 30 mol %.
5. The thick film paste of claim 2 , wherein the ZnO content of the second glass composition is about 10 to about 30 mol %.
6. The thick film paste of claim 3 , wherein the ZnO content of The second glass composition is about 10 to about 30 mol %.
7. The thick film paste of claim 3 , wherein the first glass composition comprises about 15 to about 65 mol % Bi 2 O 3 .
8. The thick film paste of claim 3 , wherein the first glass composition comprises about 15 to about 50 mol % Bi 2 O 3 .
9. The thick film paste of claim 1 , wherein the metal component comprises copper.
10. The thick film paste of claim 9 , wherein the copper is in the form of first and second powders having a bimodal size distribution, said first powder having a size distribution described by d10=0.1-0.3 microns, d50=0.6-1.1 microns and d90=1.5-3.5 microns, and said second powder having a size distribution described by d10=2-5 microns; d50=3-8 microns; and d90=15-25 microns.
11. A method of making an electronic device comprising:
a. providing a substrate and conductive thick film paste comprising a solids portion, wherein the paste comprises a glass component and a metal component, wherein the glass component comprises:
i. a first glass composition comprising in mole %:
1. about 5 to about 35% ZnO,
2. about 5 to about 40% SiO 2 , and
3. about 2 to about 35% B 2 O 3 ,
ii. a second glass composition comprising in mole %:
1. about 20 to about 70% Bi 2 O 3 ,
2. about 20 to about 50 % SiO 2 , and
3. about 2 to about 30% B 2 O 3 ,
iii. a third glass composition comprising in mole %, about 5 to about 80% Bi 2 O 3 ,
iv. no lead or lead oxide, and
v. no cadmium or cadmium oxide,
b. applying said paste upon said substrate;
c. firing the paste and substrate at a temperature of from about 650° to about 850° C.
12. The method of claim 11 , wherein the metal component comprises copper.
13. The method of claim 12 , wherein the copper is in the form of a powder having a particle size of about 0.1 micron to about 30 microns.
14. The method of claim 12 , wherein the copper is in the form of first and second powders having a bimodal size distribution, said first powder having a size distribution described by d10=0.1-0.3 microns, d50=0.6-1.1 microns and d90=1.5 -3.5 microns, and said second powder having a size distribution described by d10=2-5 microns; d50=3-8 microns; and d90=15-25 microns.
15. The method of claim 11 , wherein said substrate is selected from the group consisting of an alumina substrate, a porcelain enamel coated steel substrate, a beryllia substrate, a barium titanate substrate, an aluminum nitride substrate and a silicon carbide substrate.