Antimicrobial composition
View Patent ↗An antiseptic composition suitable for use on skin and wounds comprising a source of an antimicrobial agent and an agent which disrupts biofilms. More, particularly the invention relates to a composition capable of providing effective antimicrobial activity while at the same time avoiding wound and skin irritation and retardation of wound healing.
1. An antiseptic composition suitable for use on skin and wounds comprising 0.01% to 1.0% by weight of an antimicrobial agent comprising iodine, buffering agents to maintain the composition at a pH of about 4 to 6, and from 0.5% to 10% by weight of EDTA or its salts as an agent which disrupts biofilms, wherein the amount of iodine present in the composition is at a level of at least 50% less iodine than if EDTA were not present, such that the composition is able to reduce the bacterial bioburden present on the skin or wound to a level manageable by the host within 24 hours.
2. The antiseptic composition as claimed in claim 1 wherein the composition has a pH of between about 4.5 and 5.5.
3. The antiseptic composition as claimed in claim 1 wherein the composition is in the form of a gel.
4. The antiseptic composition as claimed in claim 1 wherein the iodine is provided by an iodine source, the iodine source is an iodide, and the iodide is held separately from the oxidant until the point of use.
5. The antiseptic composition as claimed in claim 4 wherein the composition is capable of generating from about 5 μg of iodine per gram of composition per hour to about 1500 μg of iodine per gram of composition per hour.
6. An antiseptic composition suitable for use on skin and wounds comprising buffering agents to maintain the composition at a pH of about 4 to 6, 0.01% to 1.0% by weight of iodine and from 0.5% to 10% by weight of EDTA or its salts as an agent which disrupts biofilms, wherein the amount of iodine present in the composition is at a level of at least 50% less iodine than if EDTA were not present.