Wireless communication device
View Patent ↗A wireless communication device ( 10 ) includes a dielectric base ( 50 ), a circuit board ( 70 ), an antenna ( 30 ), and a case ( 20 ). The dielectric base includes a first surface ( 508 ), a second surface ( 509 ) opposite to the first surface, a plating area ( 502 ), and a non-plating area ( 504 ). The plating area and the non-plating area are disposed on the first surface. The circuit board is disposed on the second surface. The antenna is plated on the plating area by a plating process. The circuit board and the dielectric base are received in the case.
1. A wireless communication device, comprising:
a dielectric base comprising a first surface, a second surface opposite to the first surface, a plating area, and a non-plating area, the plating area and the non-plating area being disposed on the first surface;
a circuit board disposed on the second surface;
an antenna plated on the plating area by a plating process; and
a case for receiving the circuit board and the dielectric base.
2. The wireless communication device as claimed in claim 1 , wherein the non-plating area is masked with paint for preventing the non-plating area from being plated.
3. The wireless communication device as claimed in claim 1 , wherein the dielectric base is molded from a plateable plastic material.
4. The wireless communication device as claimed in claim 1 , wherein the dielectric base further comprises at least one receiving portion extending through the first surface and the second surface thereof.
5. The wireless communication device as claimed in claim 4 , further comprising at least one conductive pin received in a corresponding one of the at least one receiving portion, the conductive pin electrically connecting the antenna and the circuit board.
6. The wireless communication device as claimed in claim 5 , wherein the at least one receiving portion comprises a pair of receiving portions.
7. The wireless communication device as claimed in claim 5 , wherein the at least one conductive pin comprises a pair of conductive pins.
8. The wireless communication device as claimed in claim 1 , wherein the wireless communication device is a mobile telephone.
9. A wireless communication device, comprising:
a dielectric base;
a circuit board disposed on the dielectric base;
a case for receiving the circuit board and the dielectric base, the case comprising a lower cover comprising an inner surface, a plating area, and a non-plating area, the plating area and the non-plating area are disposed on the inner surface; and
an antenna plated on the plating area by a plating process.
10. The wireless communication device as claimed in claim 9 , wherein the non-plating area is masked with paint for preventing the non-plating area from being plated.
11. The wireless communication device as claimed in claim 9 , wherein the lower cover is molded from a plateable plastic material.
12. The wireless communication device as claimed in claim 9 , wherein the dielectric base further comprises at least one receiving portion extending therethrough.
13. The wireless communication device as claimed in claim 12 , further comprising at least one conductive pin received in a corresponding one of the at least one receiving portion, the conductive pin electrically connecting the antenna and the circuit board.
14. The wireless communication device as claimed in claim 13 , wherein the at least one receiving portion comprises a pair of receiving portions.
15. The wireless communication device as claimed in claim 13 , wherein the at least one conductive pin comprises a pair of conductive pins.
16. The wireless communication device as claimed in claim 9 , wherein the case further comprises an upper cover mounted to the lower cover.
17. The wireless communication device as claimed in claim 9 , wherein the wireless communication device is a mobile telephone.
18. A wireless communication device, comprising:
a case enclosing said wireless communication device, comprising a cover to shield a side of said wireless communication device;
a circuit board disposed in said case and spaced from said cover of said cover of said case;
a dielectric base of an electronic component of said wireless communication device disposed and located between said circuit board and said cover to space said circuit board from said cover; and
an antenna disposed between said base of said electronic component and said cover of said case, and being electroplated on a plating area defined on a selective one of said base of said electronic component and said cover of said case by means of an electroplating process.
19. The wireless communication device as claimed in claim 18 , further comprising a conductive pin extending inside and through said base of said electronic component to electrically connect said antenna with said circuit board.