Method of manufacturing a fluid ejection device
View Patent ↗A heating element of a printhead has a conductive layer deposited over a substrate, and a resistive layer deposited over and in electrical contact with the conductive layer.
1. A method of manufacturing a fluid ejection device comprising:
disposing conductive material over a substrate;
etching the conductive material to define at least one of a conductor trace and a resistor length, wherein the conductor trace has a first section and a second section separate from the first, wherein each of the first and second sections has two opposing side surfaces, and an end surface, wherein the end surface of the first section faces the end surface of the second section, wherein the two opposing side surfaces have an angle with the substrate that is greater than the angle between the substrate and the end surface, the conductor trace having a top surface and an exposed surface area that includes the side surfaces and the top surface;
coupling the two sections of the conductor trace with a heating element, the heating element formed of a material that substantially covers the exposed surface area of the conductor trace; and
disposing a top layer over the heating element, wherein the top layer has an orifice through which heated fluid is capable of being ejected.
2. The method of claim 1 , wherein the side surfaces are substantially vertical.
3. The method of claim 1 wherein the side surfaces have an angle between about 60 to 80 degrees with the substrate.
4. The method of claim 1 wherein the side surfaces and the end surfaces have an angle between 35 and 60 degrees with the substrate.
5. The method of claim 1 wherein the conductive material is aluminum and is etched with a dry plasma.