IP Library Granted Patent US 7,582,506
Granted Patent B2
US 7,582,506 · App. 11/621,101 · Granted Sep 1, 2009

Precursor containing copper indium and gallium for selenide (sulfide) compound formation

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Quick Facts
Patent No.
US 7,582,506
App. No.
11/621,101
Granted
Sep 1, 2009
Kind
B2
Abstract

The present invention relates to systems and methods for preparing metallic precursor thin films for the growth of semiconductor compounds to be used for radiation detector and solar cell fabrication. In one aspect, there is provided a method of efficiently using expensive materials necessary for the making of solar cells.

Claims (13)

1. A method of forming a Cu(In,Ga)(S,Se)2 semiconductor layer on a base comprising;

growing a conductive layer on a substrate thus forming a base;

depositing on the conductive layer a substantially metallic film comprising copper;

electroplating a gallium film over the substantially metallic film;

electroplating an indium film over the gallium film, thereby providing a precursor stack that has an indium-rich top surface with a melting temperature of higher than that of gallium, wherein the step of electroplating the indium film is carried out at a temperature below the melting temperature of gallium; and

reacting the precursor stack with at least one of selenium and sulfur.

2. The method according to claim 1 wherein the conductive layer comprises Mo and the step of depositing uses a physical vapor deposition technique.

3. The method according to claim 2 wherein the substantially metallic film is a pure copper film.

4. The method according to claim 3 wherein the physical vapor deposition technique is sputtering.

5. The method according to claim 1 wherein the step of depositing uses electroplating.

6. The method according to claim 5 wherein the substantially metallic film is a pure copper film.

7. The method according to claim 1 wherein during the step of electroplating the indium film, the gallium film maintains a solid form.

8. The method according to claim 1 wherein the step of electroplating the indium film is carried out at a bath temperature of 10-15° C.

Assignments (7)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 13, 2013
From: SPOWER, LLC
To: SOLOPOWER SYSTEMS, INC.
Reel/Frame 031003/0067 →
MERGER Recorded Aug 9, 2013
From: SOLOPOWER, INC.
To: SPOWER, LLC
Reel/Frame 030982/0818 →
RELEASE OF SECURITY INTEREST Recorded Mar 3, 2011
From: DEUTSCHE BANK TRUST COMPANY AMERICAS
To: SOLOPOWER, INC.
Reel/Frame 025897/0374 →
SECURITY AGREEMENT Recorded Jan 20, 2011
From: SOLOPOWER, INC.
To: DEUTSCHE BANK TRUST COMPANY AMERICAS
Reel/Frame 025671/0756 →
SECURITY AGREEMENT Recorded Feb 5, 2010
From: SOLOPOWER, INC.
To: DEUTSCHE BANK TRUST COMPANY AMERICAS, AS COLLATERAL AGENT
Reel/Frame 023905/0479 →
SECURITY AGREEMENT Recorded Feb 4, 2010
From: SOLOPOWER, INC.
To: BRIDGE BANK, NATIONAL ASSOCIATION
Reel/Frame 023900/0925 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 20, 2007
From: BASOL, BULENT M.
To: SOLOPOWER, INC.
Reel/Frame 019038/0449 →