Method of fabricating an RF substrate with selected electrical properties
View Patent ↗Method for fabricating a textured dielectric substrate ( 400 ) for an RF circuit. The method can include the step ( 104 ) of selecting a plurality of dielectric substrate materials, each having a distinct combination or set of electrical properties that is different from the combination of electrical properties of every other one of dielectric substrate materials. Selecting a textured substrate patter ( 106 ) which is comprised of at least two types of distinct areas respectively having the distinct sets of electrical properties, with each distinct area dimensioned much smaller than a wavelength at a frequency of interest. Cutting the dielectric substrate materials ( 202, 204 ) into a size and shape consistent with the distinct areas of the selected pattern so as to form a plurality of dielectric pieces ( 206, 208 ). Arranging the dielectric pieces on a base plate ( 302 ) in accordance with the selected pattern to form the textured dielectric substrate.
1. A method for fabricating a textured dielectric substrate for an RF circuit comprising the steps of:
selecting a plurality of dielectric substrate materials, each of said plurality of dielectric substrate materials having a distinct set of electrical properties different from a remainder of said dielectric substrate materials;
selecting a pattern comprised of at least two types of distinct areas having said distinct sets of electrical properties and each distinct area dimensioned much smaller than a wavelength at a frequency of interest;
cutting each of said plurality of dielectric substrate materials into a size and shape consistent with said distinct areas to form dielectric pieces;
selectively arranging said dielectric pieces on a base plate in accordance with said pattern to form said textured dielectric substrate having at least one effective electrical property at a frequency of interest that is different from each of said distinct sets of electrical properties.
2. The method according to claim 1 wherein said arranging step further comprises forming a single layer of said dielectric pieces on base plate in accordance with said pattern.
3. The method according to claim 2 further comprising the step of screen printing at least one RF circuit element on said textured ceramic dielectric substrate.
4. The method according to claim 1 further comprising the step of disposing a layer of adhesive on said base plate prior to said arranging step.
5. The method according to claim 4 further comprising the step of curing said adhesive layer in a heating step.
6. The method according to claim 4 further comprising the step of screen printing at least one RF circuit element on said textured dielectric substrate.
7. The method according to claim 1 further comprising arranging said dielectric pieces using a computer controlled pick and place machine.
8. The method according to claim 1 further comprising the step of screen printing at least one RF circuit element on said textured dielectric substrate.
9. The method according to claim 1 further comprising the step of polishing a surface of said textured ceramic dielectric substrate.
10. The method according to claim 8 further comprising the step of screen printing at least one RF circuit element on said textured ceramic dielectric substrate.