De-soldering tool
View Patent ↗A de-soldering tool includes an upper heating device having an upper heating element for applying heat to an upper mating structure, the upper mating structure arranged in a pattern matching contacts in an electrical connecter soldered to a printed wiring board; a lower heating device having a lower heating element for applying heat to a lower mating structure, the lower mating structure arranged in a pattern matching the solder connections on the underside of the PWB; a controller applying power to the upper heating element and the lower heating element to liquefy solder on the contacts in the electrical connecter.
1. A de-soldering tool for de-soldering an integrated circuit socket from a thermally dissipative printed wiring board comprising:
an upper heating device having an upper heating element for applying heat to an upper mating structure, the upper mating structure arranged in a pattern matching contacts in the integrated circuit socket soldered to the thermally dissipative printed wiring board, the upper mating structure including a plurality of pins arranged to contact individual contacts in the integrated circuit socket;
a lower heating device having a lower heating element for applying heat to a lower mating structure, the lower mating structure arranged in a pattern matching leads in the integrated circuit socket, the lower mating structure including a plurality of holes arranged to receive individual leads in the integrated circuit socket;
a controller applying power to the upper heating element and the lower heating element to liquefy solder on the leads in the electrical connecter.
2. The de-soldering tool of claim 1 further comprising:
grasping clips on the upper heating device, the grasping clips positioned to engage a periphery of the electrical connector.
3. The de-soldering tool of claim 1 wherein:
the grasping clips are hingedly attached to the upper heating device.
4. The de-soldering tool of claim 1 wherein:
the upper heating element includes a plurality of heating elements.
5. The de-soldering tool of claim 1 wherein:
the lower heating element includes a plurality of heating elements.
6. The de-soldering tool of claim 1 further comprising:
a thermal probe for monitoring temperature at one of the upper mating structure and the lower mating structure, the thermal probe providing a temperature signal to the controller.
7. A method of de-soldering an integrated circuit socket soldered to a thermally dissipative printed wiring board, the method comprising:
obtaining an upper heating device having an upper heating element for applying heat to an upper mating structure, the upper mating structure arranged in a pattern matching contacts in the integrated circuit socket soldered to the thermally dissipative printed wiring board, the upper mating structure including a plurality of pins arranged to contact individual contacts in the integrated circuit socket;
placing the upper mating structure in contact with electrical contacts in the connector;
obtaining a lower heating device having a lower heating element for applying heat to a lower mating structure, the lower mating structure arranged in a pattern matching soldered leads of the integrated circuit socket, the lower mating structure including a plurality of holes arranged to receive individual leads in the integrated circuit socket;
placing the lower mating structure in contact with solder around the leads;
energizing the upper heating element; and
energizing the lower heating element.
8. The method of claim 7 further comprising:
securing grasping clips about the periphery of the connector; and
lifting the connector from the printed wiring board after energizing the upper heating element and the lower heating element.