IP Library Granted Patent US 7,602,613
Granted Patent B2
US 7,602,613 · App. 11/624,608 · Granted Oct 13, 2009

Thin module system and method

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Quick Facts
Patent No.
US 7,602,613
App. No.
11/624,608
Granted
Oct 13, 2009
Kind
B2
Abstract

A flexible circuit has contacts for mounting in a socket or card edge connector. The flexible circuit includes integrated circuit devices mounted on both sides of the edge connector contacts. Preferably, the flexible circuit is wrapped about an edge of a rigid substrate and presents contacts on both sides of the substrate for mounting in a socket. Multiple flexible circuits may be overlaid with the same strategy. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers.

Claims (4)

1. A populated flexible circuit comprising:

a flexible circuit having a first major side and a second major side, the flexible circuit exhibiting along the first major side, first-side first and second sets of contact site arrays between which is located a row of connector contacts, the second major side of the flexible circuit exhibiting second-side first and second sets of contact site arrays which correspond to the first-side first and second sets of contact site arrays, each of the first-side and second-side first and second sets of contact site arrays comprising at least two surface mount arrays, the flexible circuit providing connections between the at least two surface mount arrays of each of the first-side first and second sets of contact site arrays and the at least two surface mount arrays of each of the second-side first and second sets of contact site arrays;

a plurality of CSPs that populate the at least two surface mount arrays of each of the first-side first and second sets of contact site arrays and the at least two surface mount arrays of each of the second-side first and second sets of contact site arrays; and

a support structure about which the flexible circuit transits through a bend such that the second-side first and second sets of contact site arrays face the support structure.

Assignments (4)
MERGER Recorded Dec 27, 2015
From: OVID DATA CO. LLC
To: TAMIRAS PER PTE. LTD., LLC
Reel/Frame 037373/0481 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 2, 2012
From: ENTORIAN TECHNOLOGIES INC.
To: OVID DATA CO. LLC
Reel/Frame 029389/0672 →
MERGER Recorded Oct 25, 2012
From: ENTORIAN TECHNOLOGIES L.P.
To: ENTORIAN GP LLC
Reel/Frame 029195/0048 →
MERGER Recorded Oct 25, 2012
From: ENTORIAN GP LLC
To: ENTORIAN TECHNOLOGIES INC.
Reel/Frame 029195/0114 →