Method for electroplating metal wire
View Patent ↗A method for electroplating low-resistance metal wire for resolving the problem to fabricate the metal wire on large-area substrate through the technology of photolithographing and etching in the prior art. Then the invention improves the RC-delay characteristic of circuit on large-area substrate and reduces the number of masks for processing of a structure of gate overlap lightly-doped drain (source) (GOLDD).
1. A method for forming metal wires and TFTs of a display, comprising the steps of:
coating an isolated layer above a substrate;
depositing a semiconductor layer above the isolated layer;
depositing an oxide layer above the semiconductor layer;
depositing and patterning a first metal seed layer on the oxide layer;
doping first impurity ions into the semiconductor layer with a first doping dose by using the first metal seed layer and the oxide layer as a mask;
electroplating a first metal layer on the first metal seed layer;
doping second impurity ions into the semiconductor layer with a second doping dose by using the first metal layer as a mask;
depositing an inter-layer;
depositing and patterning a second metal seed layer; and
electroplating and patterning a second metal layer on the second metal seed layer,
wherein the second doping dose is greater than the first doping dose.
2. The method as claimed in claim 1 , wherein the semiconductor layer comprises Si, Ge or SiGe.
3. The method as claimed in claim 1 , wherein the first and second metal layer comprises low-resistance metal materials.
4. The method as claimed in claim 1 , wherein the isolated layer is used to isolate the TFTs from the substrate.
5. The method as claimed in claim 1 , wherein the step of doping the first impurity ions into the semiconductor layer with the first doping dose is performed by ion-implantation or ion shower.
6. The method as claimed in claim 1 , wherein the step of doping the second impurity ions into the semiconductor layer with the second doping dose is performed by ion-implantation or ion shower.
7. The method as claimed in claim 1 , wherein the step of electroplating the first metal layer on the first metal seed layer is carried out by immersing the substrate into an electroplating solution, which includes the metal ions the same as the first metal layer.
8. The method as claimed in claim 1 , wherein the step of electroplating the second metal layer on the second metal seed layer is carried out by immersing the substrate into an electroplating solution, which includes the metal ions the same as the second metal layer.