Support apparatus for microphone diaphragm
View Patent ↗A microphone includes a diaphragm assembly supported by a substrate. The diaphragm assembly includes at least one carrier, a diaphragm, and at least one spring coupling the diaphragm to the at least one carrier such that the diaphragm is spaced from the at least one carrier. An insulator (or separate insulators) between the substrate and the at least one carrier electrically isolates the diaphragm and the substrate.
1. A microphone comprising:
a substrate comprising a conductive, integral backplate, wherein the backplate further comprises a plurality of throughholes, and wherein the backplate forms a fixed plate of a variable capacitor;
a diaphragm assembly supported by the substrate, the diaphragm assembly including at least one carrier, a conductive diaphragm, and at least one spring coupling the diaphragm to the at least one carrier, the diaphragm being spaced from the at least one carrier; and
at least one insulator between the substrate and the at least one carrier so as to electrically isolate the diaphragm and the substrate, wherein the diaphragm forms a movable plate of the variable capacitor.
2. A microphone according to claim 1 , wherein each carrier is coupled to an insulator and wherein such insulator is coupled to the substrate.
3. A microphone according to claim 1 , wherein the diaphragm is perforated.
4. A microphone according to claim 1 , wherein the diaphragm is corrugated.
5. A microphone according to claim 1 , wherein the diaphragm has a plane when unflexed, the at least one spring producing a space between the diaphragm and the at least one carrier in the direction of the plane of the diaphragm.
6. A microphone according to claim 1 , wherein the diaphragm is stress isolated from the at least one carrier.
7. A microphone according to claim 1 , wherein the at least one carrier comprises a single unitary carrier surrounding the diaphragm.
8. A microphone according to claim 1 , wherein the at least one carrier comprises a plurality of distinct carriers.
9. A microphone according to claim 1 , wherein the at least one insulator comprises an oxide.
10. A microphone according to claim 1 , wherein the diaphragm assembly comprises polysilicon.
11. A microphone according to claim 1 , wherein the at least one insulator is formed directly or indirectly on the substrate.
12. A microphone according to claim 11 , wherein the at least one carrier is formed directly or indirectly on the at least one insulator.
13. A microphone according to claim 1 , wherein the substrate is formed from a silicon layer of a silicon-on-insulator wafer.
14. A microphone according to claim 1 , wherein the throughholes allow sound waves to reach the diaphragm from a back-side of the substrate.
15. A microphone according to claim 1 , further comprising electronic circuitry that produces a signal in response to diaphragm movement.
16. A microphone according to claim 15 , wherein the electronic circuitry is formed direct or indirectly on the substrate.
17. A microphone comprising:
a substrate comprising a conductive, integral backplate, wherein the backplate further comprises a plurality of throughholes;
a conductive diaphragm;
support means for movably coupling the diaphragm to the substrate, the support means including carrier means for fixed coupling with the substrate and suspension means for movably coupling the diaphragm to the carrier means and spacing the diaphragm from the carrier means;
insulator means for electrically isolating the diaphragm and the substrate; and
means for capacitively coupling the backplate and the diaphragm to form a fixed plate and a movable plate, respectively, of a variable capacitor.
18. A microphone according to claim 17 , further comprising means for allowing sound waves to reach the diaphragm from a back-side of the substrate.
19. A microphone according to claim 17 , further comprising means for producing a signal in response to diaphragm movement.