IP Library Granted Patent US 7,843,041
Granted Patent B2
US 7,843,041 · App. 11/625,978 · Granted Nov 30, 2010

Thin-film circuit device having a low strength region, method for manufacturing the thin-film circuit device, and electronic apparatus

Assignee: Seiko Epson Corporation
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Quick Facts
Patent No.
US 7,843,041
App. No.
11/625,978
Granted
Nov 30, 2010
Kind
B2
Abstract

A thin-film circuit device includes a substrate and a thin-film circuit layer, disposed on the substrate, having an element region and a low-strength region. The element region includes thin-film elements. The low-strength region extends between an end portion of the thin-film circuit layer and the element region and has a mechanical strength less than that of the surroundings of the low-strength region.

Claims (14)

1. A thin-film circuit device comprising:

a substrate;

a thin-film circuit layer disposed on the substrate, the thin-film circuit layer having an element region; and

a low-strength region provided in the thin-film circuit layer, the low strength region extending between an end portion of the thin-film circuit layer and the element region,

wherein the thin-film circuit layer includes a first protective layer provided on the substrate, a thin-film transistor provided on the first protective layer in the element region, and a second protective layer covering the thin-film transistor,

wherein the low-strength region has a groove formed in the second protective layer, the groove surrounding the element region, and

wherein the groove has a depth equal to at least one half of a thickness of the thin-film circuit layer.

2. The thin-film circuit device according to claim 1 , wherein the low-strength region surrounds the element region several times.

3. The thin-film circuit device according to claim 1 , wherein the low-strength region has a plurality of grooves surrounding the element region.

4. The thin-film circuit device according to claim 1 , wherein the groove has a V shape, an inverted trapezoidal shape, a rectangular shape, a semi-circular shape, or a semi-elliptical shape in cross section or partly has any one of these shapes in cross section.

5. The thin-film circuit device according to claim 1 , wherein the groove reaches the first protective layer.

6. An electronic apparatus comprising the thin-film circuit device according to claim 1 .

7. An electronic apparatus comprising the thin-film circuit device according to claim 5 .

8. The thin-film circuit device according to claim 1 , wherein the low-strength region has a mechanical strength less than that of the surroundings of the low-strength region.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 1, 2017
From: SEIKO EPSON CORPORATION
To: MICROSOFT TECHNOLOGY LICENSING, LLC
Reel/Frame 044003/0557 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 23, 2007
From: KODAIRA, TAIMEI; UTSUNOMIYA, SUMIO
To: SEIKO EPSON CORPORATION
Reel/Frame 018790/0875 →
Priority Claims (2)
JP 2006-015595 · Jan 24, 2006 · national
JP 2006-273536 · Oct 5, 2006 · national
Continuity (1)
Related Publication 20070173031A1 · Jul 26, 2007