Designing method for designing electronic component
View Patent ↗A designing method for designing an electronic component aiming at increase in designing efficiency is provided. The designing method has a step of setting a predetermined electrical characteristic, a step of determining an electric constant of the component with a first electric circuit simulation to satisfy the predetermined electrical characteristic, a step of determining a pattern shape for obtaining the electric constant, a step of retrieving and selecting an electronic component matching with the electric constant from a database, and performing layout design using the selected electronic component as a module, a step of performing a second electric circuit simulation, and a step of determining whether the electrical characteristic of the module matches with the predetermined electrical characteristic.
1. A designing method for designing an electronic component, comprising:
a first step of setting a predetermined electrical characteristic of the electronic component;
a second step of determining an electric constant of the electronic component with a first electric circuit simulation so as to satisfy the predetermined electrical characteristic;
a third step of determining a pattern shape for obtaining the determined electric constant;
a fourth step of retrieving and selecting an electronic component matching with the determined electric constant from a database, and performing a layout design using the selected electronic component as a module;
a fifth step of performing a second electric circuit simulation after the fourth step of performing the layout design; and
a sixth step of determining whether an electrical characteristic of the module matches with the predetermined electrical characteristic,
wherein
three-dimensional shape information
and electrical characteristics of the selected electronic component, three-dimensional information on allowable clearance defining a layout interval between the selected electronic component and another adjacent electronic component adjacent to it when they are laid out, and three-dimensional shape information on a wiring pattern and a via hole that connect the two adjacent electronic components to other electronic components are stored in the database.
2. The designing method of claim 1 , wherein
processes of the third step and later are performed after a process of the fifth step is performed.
3. The designing method of claim 1 , wherein
processes of the third step and later are performed after a process of the sixth step is performed.
4. The designing method of claim 1 , wherein
processes of the second, third, fourth, and fifth steps are performed by the same CAD system.
5. The designing method of claim 1 , wherein
the electronic component is formed on a low-temperature fired ceramic substrate.
6. The designing method of claim 5 , wherein
the electronic component includes at least one of a capacitor, an inductor, and a resistor.
7. The designing method of claim 5 , wherein
the low-temperature fired ceramic substrate is a multilayer circuit board.