Mounting board, mounted body, and electronic equipment using the same
View Patent ↗The mounting board has a capacitor-forming sheet made from a valve metal, first and second board-forming structures, first and second electrodes, an extractor electrode, and a conductive polymer. The capacitor-forming sheet has an inner layer and a rough oxide film on at least one face of the inner layer. The first board-forming structure is provided on a face of the capacitor-forming sheet, and the second board-forming structure is provided on another face thereof on a side opposite to the first one. The first and second electrodes are isolated to each other and provided on a surface of at least one of the first and second board-forming structures. The extractor electrode and conductive polymer are provided inside at least one of the first and second board-forming structures. The extractor electrode electrically-connects the first electrode with the inner layer. The conductive polymer electrically-connects the second electrode with the rough oxide film.
1. A mounting board comprising:
a capacitor-forming sheet made from a valve metal, and having a first face and a second face opposite to the first face, and having an inner layer and a rough oxide film provided on at least one face on a side of the first face and a side of the second face of the inner layer;
a first board-forming structure provided on the first face side of the capacitor-forming sheet;
a second board-forming structure provided on the second face side of the capacitor-forming sheet;
a first electrode provided on a surface of at least one of the first and second board-forming structures;
a second electrode provided on a surface of at least one of the first and second board-forming structures, and electrically isolated from the first electrode;
an extractor electrode provided inside at least one of the first and second board-forming structures, and electrically connecting the first electrode and the inner layer; and
a conductive polymer provided inside at least one of the first and second board-forming structures, and electrically connecting the second electrode and the rough oxide film.
2. The mounting board according to claim 1 , wherein the capacitor-forming sheet is divided into capacitor-forming elemental structures in a direction parallel with the first face by an insulating layer made of resin, the capacitor-forming elemental structures being electrically independent of each other and
the first electrode, the second electrode, the extractor electrode and the conductive polymer are provided for each capacitor-forming elemental structure, respectively.
3. The mounting board according to claim 1 , wherein the extractor electrode is in electrical contact with the first electrode in a shortest distance, and
the conductive polymer is in electrical contact with the second electrode in a shortest distance.
4. The mounting board according to claim 1 , wherein the extractor electrode is formed by through-hole plating.
5. The mounting board according to claim 1 , wherein the first and second electrodes contain copper.
6. The mounting board according to claim 1 , further comprising a metal layer provided on the second face of the capacitor-forming sheet and in electrical contact with the inner layer and the extractor electrode.
7. The mounting board according to claim 1 , wherein the rough oxide film is provided on both faces of the capacitor-forming sheet on the first and second face sides.
8. The mounting board according to claim 1 , wherein the conductive polymer contains at least one of polypyrrole, polyaniline and polythiophene.
9. The mounting board according to claim 1 , further comprising a middle electrode interposed between the conductive polymer and the second electrode.
10. The mounting board according to claim 1 , wherein the first board-forming structure has:
a first insulating layer formed by impregnation into the rough oxide film; and
a second insulating layer formed on the first insulating layer, the second insulating layer being made from an admixture of inorganic filler and a heat-hardening resin.
11. A mounted body, comprising:
the mounting board according to claim 1 ; and
a semiconductor device electrically connected with the first and second electrodes of the mounting board.
12. An electronic equipment comprising:
a mounted body having:
the mounting board according to claim 1 , and
a semiconductor device electrically connected with the first and second electrodes of the mounting board;
a housing provided with the mounted body therein.
13. The mounting board according to claim 6 , wherein the metal layer contains at least one of copper and nickel.
14. The mounting board according to claim 9 , wherein the middle electrode contains at least one of silver, copper, and nickel.
15. The mounting board according to claim 9 , wherein the middle electrode interposed between the conductive polymer and the second electrode composed of silver paste alone.
16. The mounting board according to claim 10 , wherein the second board-forming structure and second insulating layer are made of the same material.
17. The mounted body according to claim 11 , further comprising a wiring layer interposed between the first and second electrodes of the mounting board and the semiconductor device.
18. The mounting board according to claim 16 , wherein the second board-forming structure and second insulating layer are constructed so as to have substantially the same thickness.
19. The mounted body according to claim 17 , wherein the wiring layer is finely formed on a surface of the mounting board by plating connection according to a buildup method.