Module
A module includes a first multilayer wiring board, a second multilayer wiring board having an upper surface facing a lower surface of the first multilayer wiring board, a component mounted on an upper surface of the first multilayer wiring board, a first terminal electrode provided on the lower surface of the first multilayer wiring board, a second terminal electrode provided on the upper surface of the second multilayer wiring board and connected to the first terminal electrode, and a terminal electrode provided on a lower surface of the second multilayer wiring board. This module is manufactured at a preferable yield rate.
1 . A module comprising:
a first multilayer wiring board having a first surface and a second surface opposite to the first surface;
a second multilayer wiring board having a third surface and a fourth surface opposite to the third surface, the third surface facing the second surface of the first multilayer wiring board;
a component mounted on the first surface of the first multilayer wiring board;
a first terminal electrode provided on the second surface of the first multilayer wiring board;
a second terminal electrode provided on the third surface of the second multilayer wiring board, the second terminal electrode being connected to the first terminal electrode; and
a terminal electrode provided on the fourth surface of the second multilayer wiring board.
2 . The module of claim 1 , wherein
the first multilayer wiring board has an area smaller than an area of the second multilayer wiring board, and
the third surface of the second multilayer wiring board has an exposing portion that exposes outside the first multilayer wiring board, said module further comprising:
a grounding electrode provided on the exposing portion of the third surface of the second multilayer wiring board; and
a shield case provided on the grounding electrode, the shield case being connected to the grounding electrode, the shield case covering the first multilayer wiring board.