Gallium nitride material devices including conductive regions and methods associated with the same
View Patent ↗Semiconductor structures comprising a III-nitride (e.g., gallium nitride) material region and methods associated with such structures are provided. In some embodiments, the structures include an electrically conductive material (e.g., gold) separated from certain other region(s) of the structure (e.g., a silicon substrate) by a barrier material in order to limit, or prevent, undesirable reactions between the electrically conductive material and the other component(s) which can impair device performance. In certain embodiments, the electrically conductive material may be formed in a via. For example, the via can extend from a topside of the device to a backside so that the electrically conductive material connects a topside contact to a backside contact. The structures described herein may form the basis of a number of semiconductor devices including transistors (e.g., FET), Schottky diodes, light-emitting diodes and laser diodes, amongst others.
1. A semiconductor device structure comprising:
a substrate;
a gallium nitride material region formed on the substrate;
a first electrical contact formed on the gallium nitride material region;
an electrically conductive material layer formed over, at least a portion of, the substrate; and
a barrier material layer separating the electrically conductive material layer from the substrate, wherein a via is formed in the structure and the electrically conductive material layer and the barrier material layer are formed on sidewalls of the via.
2. The device structure of claim 1 , wherein the via extends into at least a portion of the silicon substrate and the barrier material layer separates the electrically conductive material layer from the silicon substrate.
3. The device structure of claim 1 , wherein the barrier material further extends from the sidewall of the via onto a backside of the structure.
4. The device structure of claim 1 , wherein the via extends only through a portion of the substrate.
5. The device structure of claim 1 , wherein the via extends from a topside of the structure to a backside of the structure.
6. The device structure of claim 1 , wherein the substrate is silicon.
7. The device structure of claim 6 , wherein the silicon substrate has a resistivity of greater than 10 kilo-Ohms.
8. The device structure of claim 1 , wherein the electrically conductive material layer comprises gold.
9. The device structure of claim 1 , wherein the electrically conductive material layer formed on the barrier material in the via consists essentially of gold.
10. The device structure of claim 1 , wherein the electrically conductive material layer includes a first layer portion comprising gold and a second layer portion having a different composition than the first layer portion.
11. The device structure of claim 10 , wherein the second layer portion comprises copper.
12. The device structure of claim 1 , further comprising a passivating layer formed over the gallium nitride material region.
13. A semiconductor device structure comprising:
a substrate;
a gallium nitride material region formed on the substrate;
a first electrical contact formed on the gallium nitride material region;
an electrically conductive material layer formed over, at least a portion of, the substrate;
a barrier material layer separating the electrically conductive material layer from the substrate; and
a second electrical contact formed on a backside of the structure,
wherein an electrically conductive pathway is formed in a via and extends from the first metal contact to the second metal contact, at least a portion of the electrically conductive pathway comprising the electrically conductive material.
14. A semiconductor device structure comprising:
a substrate;
a gallium nitride material region formed on the substrate;
a first electrical contact formed on the gallium nitride material region;
an electrically conductive material layer formed over, at least a portion of, the substrate;
a barrier material layer separating the electrically conductive material layer from the substrate,
wherein the structure is a transistor and further comprises a source electrode, a drain electrode and a gate electrode, wherein the first electrical contact is electrically connected to the source electrode.
15. The device structure of claim 14 , wherein an electrically conductive pathway comprising at least in part the electrically conductive material connects the source electrode to a contact at a backside of the structure.
16. The device structure of claim 1 , further comprising a transition layer formed between the substrate and the gallium nitride material region.
17. The device structure of claim 16 , wherein the transition layer is compositionally-graded.
18. The device structure of claim 16 , further comprising an amorphous silicon nitride layer formed between the substrate and the transition layer.
19. A semiconductor device structure comprising:
a substrate including a top surface and a back surface;
a gallium nitride material region formed on the front surface of the substrate;
a first metal region formed on the gallium nitride material region;
a second metal region formed on the back surface of the substrate;
a barrier material formed on, at least a portion, of a sidewall of a via extending through the gallium nitride material region and the substrate; and
an electrically conductive material formed on the barrier material in the via extending from the first metal region to the second metal region.