IP Library Granted Patent US 8,006,356
Granted Patent B2
US 8,006,356 · App. 11/635,409 · Granted Aug 30, 2011

Method of forming an array of drop generators

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Quick Facts
Patent No.
US 8,006,356
App. No.
11/635,409
Granted
Aug 30, 2011
Kind
B2
Abstract

A method for making an electromechanical device including forming an electromechanical transducer that includes a deposited metallic diaphragm, and attaching the electromechanical transducer to a fluid channel substructure.

Claims (31)

1. A method of making a plurality of electromechanical transducers, comprising:

forming an array of piezo elements on a rigid carrier substrate, wherein the piezo elements are formed from a laminar structure of layered conductive and piezoelectric material, a first side of the laminar structure mechanically attached to the rigid carrier substrate by means of a removable double-sided tape;

planarizing the array of the piezo elements by filling regions between each of the piezo elements with a polymer;

attaching a second, opposite side of the planarized array to a fluid channel substructure; and

removing the rigid carrier substrate and the double-sided tape from the laminar structure.

2. The method of claim 1 , further including:

before the planarizing of the array, dicing the laminar structure comprising the conductive layer and the piezoelectric material;

and

after the planarizing of the array, depositing a metal layer on the second side of the planarized diced laminar structure to form deposited metal diaphragms, wherein the second side corresponds to the piezoelectric material.

3. The method of claim 2 wherein the deposited metal diaphragms are formed by electroless deposition.

4. The method of claim 2 wherein the deposited metal diaphragms are formed by electroplating.

5. The method of claim 2 wherein the deposited metal diaphragms are formed by vacuum deposition.

6. The method of claim 2 wherein the deposited metal diaphragms comprise nickel.

7. The method of claim 2 wherein the deposited metal diaphragms comprise chromium.

8. The method of claim 2 wherein forming of the array of the piezo elements and the deposited metal diaphragms comprises screen printing a plurality of the piezo elements.

9. The method of claim 2 , further including: forming the array of piezo elements by dicing or kerfing the conductive and piezoelectric material to form the array.

10. The method of claim 1 wherein forming the plurality of piezo elements and the deposited metal diaphragms comprises:

depositing the metal layer on the laminar structure comprising the conductive and the piezoelectric material, and the deposited metal diaphragms; and

dicing the laminar structure to produce a plurality of individual piezoelectric transducers.

11. The method of claim 1 further comprising forming an attachment layer on the plurality of piezoelectric transducers.

12. The method of claim 1 further comprising forming a solder layer on the plurality of piezoelectric transducers.

13. The method of claim 1 further comprising forming an adhesive layer on the plurality of piezo elements and the deposited metal diaphragms.

14. The method of claim 1 wherein attaching the fluid channel layer comprises attaching a fluid channel substructure having a conductive polymer diaphragm sub-layer.

15. The method of claim 1 wherein attaching the fluid channel layer comprises attaching a fluid channel substructure having a conductive polyimide diaphragm sub-layer.

16. A method of making a plurality of electromechanical transducers, comprising:

mechanically attaching a laminar structure to a rigid carrier substrate using a double-sided tape;

forming an array of piezo elements by dicing the laminar structure comprising a conductive layer and a piezoelectric layer to produce a plurality of individual piezoelectric transducers;

planarizing the diced laminar structure; and

depositing a metal layer on the array of piezo elements to form piezoelectric transducers; and

attaching the piezoelectric transducers to a fluid channel substructure; and,

removing the rigid carrier substrate and the double-sided tale from the laminar structure.

Assignments (9)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 6, 2025
From: XEROX CORPORATION
To: GENESEE VALLEY INNOVATIONS, LLC
Reel/Frame 073842/0479 →
SECOND LIEN NOTES PATENT SECURITY AGREEMENT Recorded Jul 2, 2025
From: XEROX CORPORATION
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 071785/0550 →
FIRST LIEN NOTES PATENT SECURITY AGREEMENT Recorded Apr 11, 2025
From: XEROX CORPORATION
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 070824/0001 →
SECURITY INTEREST Recorded Feb 13, 2024
From: XEROX CORPORATION
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 066741/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT RF 064760/0389 Recorded Feb 13, 2024
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: XEROX CORPORATION
Reel/Frame 068261/0001 →
SECURITY INTEREST Recorded Nov 20, 2023
From: XEROX CORPORATION
To: JEFFERIES FINANCE LLC, AS COLLATERAL AGENT
Reel/Frame 065628/0019 →
SECURITY INTEREST Recorded Jun 22, 2023
From: XEROX CORPORATION
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 064760/0389 →
RELEASE OF SECURITY INTEREST IN PATENTS AT R/F 062740/0214 Recorded May 18, 2023
From: CITIBANK, N.A., AS AGENT
To: XEROX CORPORATION
Reel/Frame 063694/0122 →
SECURITY INTEREST Recorded Nov 10, 2022
From: XEROX CORPORATION
To: CITIBANK, N.A., AS AGENT
Reel/Frame 062740/0214 →