Printhead assembly with an ink distribution molding and a composite IC carrier
View Patent ↗A printhead assembly includes a printhead which, in turn, includes a molding. The molding defines a recess in which an integrated circuit (IC) configured to eject ink can be received. The carrier defines a plurality of separate ink passages each in fluid communication with the IC. An elongate support member supports the printhead and defines a plurality of separate ink reservoirs each in fluid communication with a respective ink passage. The support member includes a core element which defines the ink reservoirs and a shell in which the core element can be received.
1. A printhead assembly comprising:
a printhead comprising an elongate molding which defines a recess in which an integrated circuit (IC) configured to eject ink can be received, the molding defining a plurality of separate ink passages each in fluid communication with the IC; and
an elongate support member which supports the printhead, and defines a plurality of separate ink reservoirs each in fluid communication with a respective ink passage and each axially extending along the support member; the support member comprising a core element which defines the ink reservoirs and a shell in which the core element can be received.
2. A printhead assembly as claimed in claim 1 , wherein the shell comprises a plurality of metal layers which together define the shell with a coefficient of thermal expansion which is comparable to that of silicon.
3. A printhead assembly as claimed in claim 2 , wherein one of the layers has a first co-efficient of thermal expansion and is located between a pair of layers each having a second co-efficient of thermal expansion.
4. A printhead assembly as claimed in claim 3 , wherein the first co-efficient of thermal expansion is greater than the second co-efficient of thermal expansion.
5. A printhead assembly as claimed in claim 4 , wherein the second co-efficient of thermal expansion is about 1.3×10 −6 m/° C.
6. A printhead assembly as claimed in claim 4 , wherein the first co-efficient of thermal expansion exceeds 2.5×10 −6 m/° C.
7. A printhead assembly as claimed in claim 1 , wherein the molding is a micro-molding.
8. A printhead assembly as claimed in claim 1 , wherein the core element is molded from plastics material.