Granted Patent B1

US 9,196,270 · App. 11/635,830 · Granted Nov 24, 2015

Abstract

Claims (28)

1. A method for providing at least one magnetoresistive device comprising;

depositing a plurality of magnetoresistive element layers, the plurality of magnetoresistive element layers covering at least one device area and at least one field area;

providing a single layer mask, the single layer mask covering a first portion of the plurality of magnetoresistive element layers in the at least one device area and exposing a second portion of the plurality of magnetoresistive element layers in the at least one field area, the single layer mask covering not more than substantially ten percent of the plurality of magnetoresistive element layers, the single layer mask having a bottom surface and a top surface not substantially wider than the bottom surface such that the single layer mask is substantially free of an undercut, the bottom surface being closer to the plurality of magnetoresistive element layers than the top surface;

defining at least one magnetoresistive element using only the single layer mask to cover a third portion of the plurality of magnetoresistive element layers used to form the at least one magnetoresistive element, thereby removing the second portion of the plurality of magnetoresistive element layers exposed by the single layer mask;

depositing a hard bias layer on the at least one device area and the at least one field area after the defining of the at least one magnetic element; and

performing a planarization after the hard bias layer is deposited.

2. The method of claim 1 further comprising:

providing a planarization stop layer between the plurality of magnetoresistive element layers and the single mask layer.

3. The method of claim 2 wherein the planarization stop layer providing further includes:

providing a chemical mechanical planarization stop layer on the plurality of magnetic element layers before the providing of the single layer mask.

4. The method of claim 3 wherein the chemical mechanical planarization stop layer providing further includes:

providing a diamond like carbon layer.

5. The method of claim 3 wherein the planarization performing further includes:

performing a chemical mechanical planarization.

6. The method of claim 2 further comprising:

providing an antireflective coating layer between the planarization stop layer and the single layer mask.

7. The method of claim 6 wherein the antireflective coating layer:

is a dielectric antireflective coating layer.

8. The method of claim 2 wherein the at least one magnetoresistive element defining further includes:

removing a portion of the planarization stop layer in the at least one field area; and

removing the second portion of the plurality of magnetoresistive layers in the at least one field area.

9. The method of claim 8 wherein the removing the portion of the planarization stop layer further includes:

performing a reactive ion etch.

10. The method of claim 8 wherein the removing the second portion of the plurality of magnetoresistive layers further includes:

performing at least one ion milling step.

11. The method of claim 1 wherein the at least one magnetoresistive element is at least one spin valve.

12. The method of claim 1 wherein the step of providing the single layer mask further includes:

providing the single layer mask covering ten percent of the plurality of magnetoresistive element layers.

Assignments (9)