Nitride semiconductor laser element and fabrication method thereof
View Patent ↗On a nitride semiconductor layered portion formed on a substrate, there are formed an insulating film and a p-side electrode in this order. Furthermore, an end portion electrode protection layer is formed above the p-side electrode, around a position where cleavage will take place.
1. A nitride semiconductor laser element comprising:
a substrate;
a nitride semiconductor layered portion having a plurality of nitride semiconductor layers laid one after another on the substrate, and having a ridge stripe-shaped waveguide provided therein;
an insulating layer formed on the nitride semiconductor layered portion and having an opening above the waveguide;
a first electrode provided above the waveguide and the insulating layer; and
a cavity end face perpendicular to a length direction of the waveguide, wherein,
above the first electrode, an end portion electrode protection layer is provided of which an end face is flush with the end face of the cavity, and
part of the end portion electrode protection layer is located directly above a central longitudinal axis of the waveguide,
wherein the end portion electrode protection layer is contiguous with the first electrode, and is contiguous with the insulating layer on at least one side of the first electrode with respect to a direction perpendicular to the length direction of the waveguide.
2. The nitride semiconductor laser element according to claim 1 ,
wherein the end portion electrode protection layer and the insulating layer are each composed of one or more layers, and a layer of the end portion electrode protection layer contiguous with the first electrode and a layer of the insulating layer contiguous with the first electrode are formed of a same material.
3. The nitride semiconductor laser element according to claim 1 ,
wherein the end portion electrode protection layer and the insulating layer are each composed of two or more layers, and have symmetric layer structures with respect to the first electrode.
4. The nitride semiconductor laser element according to claim 1 ,
wherein the first electrode has a thickness of 30 Å or more but 1 000 Å or less.
5. The nitride semiconductor laser element according to claim 1 ,
wherein a second electrode is provided above the first electrode and the insulating layer.
6. The nitride semiconductor laser element according to claim 5 ,
wherein the second electrode has a wire bonding portion to which a wire is bonded to electrically connect the nitride semiconductor laser element to outside, and the second electrode has, in the wire bonding portion, a reinforcement layer below the second electrode, the reinforcement layer having a same layer structure as the end portion electrode protection layer.
7. The nitride semiconductor laser element according to claim 1 ,
wherein a second electrode is provided above the end portion electrode protection layer, the first electrode, and the insulating layer.
8. The nitride semiconductor laser element according to claim 7 ,
wherein the second electrode has an end face thereof located inward of the end face of the cavity.
9. The nitride semiconductor laser element according to claim 7 ,
wherein the second electrode has a wire bonding portion to which a wire is bonded to electrically connect the nitride semiconductor laser element to outside, and the second electrode has, in the wire bonding portion, a reinforcement layer below the second electrode, the reinforcement layer having a same layer structure as the end portion electrode protection layer.
10. The nitride semiconductor laser element according to claim 1 , wherein, above the waveguide, elsewhere than near the end face of the cavity, there is a region where the end portion electrode protection layer is not provided.
11. The nitride semiconductor laser element according to claim 1 , wherein the end portion electrode protection layer is contiguous with the insulating layer on at least one side of the end portion electrode protection layer with respect to a direction perpendicular to the length direction of the waveguide, and the end portion electrode protection layer contains at least a dielectric material or a compound semiconductor comprising AlGaN.
12. The nitride semiconductor laser element according to claim 1 , wherein the end portion electrode protection layer extends along the cavity end face as a continuous structure.
13. The nitride semiconductor laser element according to claim 1 , wherein an end part of the end portion electrode protection layer does not terminate over the waveguide.
14. A nitride semiconductor laser element comprising:
a substrate;
a nitride semiconductor layered portion having a plurality of nitride semiconductor layers laid one after another on the substrate, and having a ridge stripe-shaped waveguide provided therein;
an insulating layer formed on the nitride semiconductor layered portion and having an opening above the waveguide;
a first electrode provided above the waveguide and the insulating layer; and
a cavity end face perpendicular to a length direction of the waveguide, wherein,
above the first electrode, an end portion electrode protection layer is provided of which an end face is flush with the end face of the cavity, the end portion electrode protection layer extending along the cavity end face so as to cross over the ridge stripe-shaped waveguide,
wherein the end portion electrode protection layer is contiguous with the first electrode, and is contiguous with the insulating layer on at least one side of the first electrode with respect to a direction perpendicular to the length direction of the waveguide.