IP Library › Granted Patent US 7,466,015
Granted Patent B2
US 7,466,015 · App. 11/636,708 · Granted Dec 16, 2008

Supporting frame for surface-mount diode package

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Quick Facts
Patent No.
US 7,466,015
App. No.
11/636,708
Granted
Dec 16, 2008
Kind
B2
Abstract

A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame instead of the diode chip. Otherwise the stress may damage the diode chip. wherein said supporting forms a cantilever over said first metallic contact and the overhanging end of the cantilever is glued to said second metallic contact.

Claims (8)

1. A surface mount diode package, comprising:

a diode chip having a top electrode and a bottom electrode;

a zigzag metallic contact, having a top plate and a bottom plate, said top plate being coupled to said top electrode;

a metallic flat contact, coplanar with said bottom plate for surface mounting, coupled to said bottom electrode for surface mounting;

a supporting frame having a window, mounted on said flat metallic contact, surrounding said diode chip and solidly bridging between said zigzag metallic contact and said metallic flat contact to prevent bending of said single diode chip.

2. The surface mount diode package as described in claim 1 , wherein said supporting frame is partially covered by said top plate.

3. The surface mount diode package as described in claim 1 , wherein the window of the supporting frame is of circular shape.

4. The surface mount diode package as described in claim 1 , wherein the window of the supporting frame is of conical shape.