Deposition apparatus

1. A deposition apparatus comprising:

a chamber;

a mask assembly comprising a mask arranged to deposit a material on a surface of a substrate in the chamber and a mask frame for supporting the mask; and

a magnet unit for contacting a surface of the mask assembly to the surface of the substrate by magnetic force, the magnet unit comprising a first magnet unit corresponding to the mask and providing a first magnetic force for contacting the surface of the mask assembly to the surface of the substrate and a second magnet unit corresponding to the mask frame and providing a second magnetic force for contacting the surface of the mask assembly to the surface of the substrate,

wherein the first magnetic force is weaker than the second magnetic force and

wherein a magnetic flux density of the first magnet unit is smaller than a magnetic flux density of the second magnet unit.

2. The deposition apparatus of claim 1 , wherein the magnetic flux density of the first magnet unit is about 250 to about 350 gauss.

3. The deposition apparatus of claim 1 , wherein the magnetic flux density of the second magnet unit is about 650 to about 750 gauss.

4. The deposition apparatus of claim 1 , wherein the material is deposited on the substrate by plasma deposition.

5. The deposition apparatus of claim 1 , wherein the magnet unit further comprises a gap plate between the mask and the first and second magnet units.

6. The deposition apparatus of claim 1 , wherein the mask frame surrounds the mask.

7. The deposition apparatus of claim 1 , wherein the second magnet unit is formed along edges of the first magnet unit.

8. The deposition apparatus of claim 7 , wherein the second magnet unit is formed to surround the first magnet unit.

9. A deposition apparatus comprising:

a deposition source for depositing a material to a substrate;

a mask assembly comprising a mask arranged to deposit the material on the substrate and a mask frame for supporting the mask; and

a magnet unit for contacting the mask assembly to the substrate by magnetic force, the magnet unit comprising a first magnet unit corresponding to the mask and providing a first magnetic force for contacting the mask assembly to a surface of the substrate facing the deposition source and a second magnet unit corresponding to the mask frame and providing a second magnetic force for contacting the mask assembly to the surface of the substrate facing the deposition source,

wherein the second magnetic force is stronger than the first magnetic force, and

wherein a magnetic flux density of the first magnet unit is smaller than a magnetic flux density of the second magnet unit.

10. The deposition apparatus of claim 9 , wherein the material is deposited from the deposition source to the substrate through the mask assembly.

11. The deposition apparatus of claim 10 , wherein the material is deposited on the substrate by plasma deposition.

12. The deposition apparatus of claim 9 , wherein the magnetic flux density of the first magnet unit is about 250 to about 350 gauss.

13. The deposition apparatus of claim 9 , wherein the magnetic flux density of the second magnet unit is about 650 to about 750 gauss.

14. The deposition apparatus of claim 9 , wherein the magnetic flux density of the first magnet unit is about 250 to about 350 gauss, and wherein the magnetic flux density of the second magnet unit is about 650 to about 750 gauss.

15. The deposition apparatus of claim 9 , wherein the magnet unit further comprises a gap plate between the mask and the first and second magnet units.

16. The deposition apparatus of claim 9 , wherein the mask frame surrounds the mask.

17. The deposition apparatus of claim 9 , wherein the second magnet unit is formed along edges of the first magnet unit.

18. The deposition apparatus of claim 9 , wherein the second magnet unit is formed to surround the first magnet unit.