Semiconductor device, mounting substrate and method of manufacturing mounting substrate, circuit board, and electronic instrument
View Patent ↗There is provided a semiconductor device comprising: a first plating layer formed on one surface of an interconnect pattern; a second plating layer formed within through holes in the interconnect pattern; a semiconductor chip electrically connected to the first plating layer; an anisotropic conductive material provided on the first plating layer; and a conductive material provided on the second plating layer, wherein the first plating layer has appropriate adhesion properties with the anisotropic conductive material, and the second plating layer has appropriate adhesion properties with the conductive material.
1. A method of manufacturing a semiconductor device, the method comprising:
forming a through hole in a substrate and an interconnect pattern on the substrate, a first portion of the interconnect pattern passing over the through hole;
forming a first plating layer by covering a first surface of the first portion of the interconnect pattern with a first resist and by applying electroless plating to the interconnect pattern so that the first plating layer is formed on a second surface of the interconnect pattern, the first surface being on the side of the substrate, and the second surface being opposite to the first surface;
forming a second plating layer by exposing the first surface of the first portion of the interconnect pattern, and by covering the second surface of the interconnect pattern with a second resist, and by applying electroless plating to the interconnect pattern so that the second plating layer is formed on the first surface of the first portion of the interconnect pattern;
mounting a semiconductor chip on the substrate with a resin positioned between the semiconductor chip and the substrate, the resin'being positioned on the first plating layer; and
providing a conductive material on the second plating layer,
wherein the first plating layer is positioned between the interconnect pattern and the resin, and the second plating layer is thicker than the first plating layer.
2. The method of manufacturing the semiconductor device as defined in claim 1 ,
wherein the first and second plating layers are formed of different materials.
3. A method of manufacturing a mounting substrate comprising the steps of:
forming a first interconnect pattern on a first surface of a substrate;
forming a second interconnect pattern electrically connected to the first interconnect pattern on a second surface of the substrate opposite to the first surface of the substrate;
forming a first plating layer by covering the second interconnect pattern with a first resist and by applying electroless plating to the first interconnect pattern;
forming a second plating layer by covering the first interconnect pattern with a second resist and by applying electroless plating to the second interconnect pattern;
mounting a semiconductor chip on the substrate with a resin positioned between the semiconductor chip and the substrate, the resin being positioned on the first plating layer; and
providing a conductive material on the second plating layer,
wherein the first plating layer is positioned between the first interconnect pattern and the resin, and the second plating layer is thicker than the first plating layer.
4. The method of manufacturing the semiconductor device as defined in claim 3 ,
wherein the first and second plating layers are formed of different materials.
5. A method of manufacturing a semiconductor device, the method comprising:
forming an interconnect pattern on a substrate;
forming a first plating layer on a first surface of a first portion of the interconnect pattern opposite to the substrate by covering a first surface of a second portion of the interconnect pattern opposite to the substrate with a first resist and exposing the first surface of the first portion of the interconnect pattern, and by applying electroless plating to the interconnect pattern; and
forming a second plating layer on the first surface of the second portion of the interconnect pattern by covering the first surface of the first portion of the interconnect pattern with a second resist and exposing the first surface of the second portion of the interconnect pattern, and by applying electroless plating to the interconnect pattern, the second plating layer being in contact with the first plating layer; and
mounting a semiconductor chip on the substrate with a resin positioned between the semiconductor chip and the substrate, the resin being positioned on the first plating layer, and with a conductive material electrically connecting the semiconductor chip to the interconnect pattern and being positioned on the second plating layer,
wherein the first plating layer is positioned between the first portion of the interconnect pattern and the resin, and the second plating layer is thicker than the first plating layer.
6. The method of manufacturing the semiconductor device as defined in claim 5 ,
wherein the first and second plating layers are formed of different materials.