IP Library Granted Patent US 7,773,166
Granted Patent B2
US 7,773,166 · App. 11/638,384 · Granted Aug 10, 2010

Organic thin film transistor and method of manufacturing the organic thin film transistor, and display apparatus using the same

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Quick Facts
Patent No.
US 7,773,166
App. No.
11/638,384
Granted
Aug 10, 2010
Kind
B2
Abstract

Provided are an organic semiconductor structure and a method of manufacturing the same, an organic thin film transistor (OTFT) using the organic semiconductor structure and a method of manufacturing the OTFT, and a display apparatus using the same. The OTFT includes: an oxide layer formed on a base substrate; a source electrode on the oxide layer, wherein the source electrode includes a first source electrode portion and a second source electrode portion; a drain electrode on the oxide layer, wherein the drain electrode includes a first drain electrode portion and a second drain electrode portion; an organic layer pattern having an opening that exposes the first source electrode portion and the first drain electrode portion; an organic semiconductor pattern electrically connected to the first source electrode portion and the first drain electrode portion through the opening, wherein the organic semiconductor pattern has a conductive or an insulating property depending on an applied electric field in a location; a gate insulating layer covering the organic semiconductor pattern; and a gate electrode formed on the gate insulating layer corresponding to the organic semiconductor pattern.

Claims (12)

1. A method of manufacturing an organic thin film transistor (OTFT), the method comprising:

forming an oxide layer on a base substrate;

forming source and drain electrodes on the oxide layer, wherein the source electrode is spaced apart from the drain electrode and exposing a portion of the oxide layer;

forming a organic layer pattern having an opening on the base substrate, the opening exposing portions of the source and drain electrodes and the portion of the oxide layer;

treating the exposed portions of the source and drain electrodes and the potion of the oxide layer by an O 2 plasma to form a hydrophilic source electrode portion in the source electrode and a hydrophilic drain electrode portion in the drain electrode;

forming a hydrophilic organic semiconductor pattern electrically connected to hydrophilic source electrode portion and the hydrophilic drain electrode portion through the opening; forming a gate insulating layer covering the hydrophilic organic semiconductor pattern; and

forming a gate electrode on a predetermined portion of the gate insulating layer corresponding to the organic semiconductor pattern.

2. The method according to claim 1 , wherein the forming of the organic semiconductor pattern includes:

coating a fluid organic semiconductor material on the organic layer pattern so that the organic semiconductor material fills the opening; and

hardening the organic semiconductor material to form an organic semiconductor pattern.

3. The method according to claim 1 , wherein the organic layer pattern has a photosensitive substance.

4. The method according to claim 1 , wherein the organic layer pattern includes an acryl based synthetic resin.

Assignments (2)
CHANGE OF NAME Recorded Oct 17, 2008
From: LG. PHILIPS LCD CO., LTD.
To: LG DISPLAY CO., LTD.
Reel/Frame 021773/0029 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 14, 2006
From: CHOI, NACK BONG; KIM, MIN JOO
To: LG.PHILIPS LCD CO., LTD.
Reel/Frame 018712/0723 →