Manufacturing method of semiconductor device
View Patent ↗Size of a chipping is made small, suppressing blinding of a blade, when performing dicing of a wafer. When cutting a wafer, cutting is performed so that the portion of a V character-shaped shoulder may enter below the front surface of a wafer (depth Z 2 from a substrate front surface) using the metal-bond blade which includes the abrasive particle whose fineness number is more than #3000, and whose point is V character form. By processing it in this way, cutting resistance goes up and blinding of a blade can be prevented. Hereby, the size of a chipping can be suppressed small, preventing blinding of a blade.
1. A method of manufacturing a semiconductor device comprising the steps of:
(a) preparing a semiconductor wafer having a plurality of semiconductor chip regions divided by a plurality of dicing lines, said semiconductor wafer including
a silicon substrate,
a plurality of transistors formed on the surface of said silicon substrate,
a first insulating layer of a silicon oxide film formed on said plurality of transistors,
a plurality of wiring layers formed on said first insulating layer,
at least a second insulating layer formed in between said plurality of wiring layers, said second insulating layer having lower dielectric constant than said silicon oxide film, said second insulating layer extending onto said dicing lines,
(b) preparing a first blade and a second blade,
said first blade including a first portion of a first width and a second portion formed integrally with said first portion, said second portion being formed in a V character shape and having an edge point of second width smaller than the first width,
said second blade having a third width smaller than said first width and larger than said second width,
(c) performing a first dicing step for cutting said semiconductor wafer by said first blade along said dicing line, and for making said first portion of said first blade reach into said silicon substrate to form a first groove in said silicon substrate along said dicing line,
(d) performing a second dicing step for cutting said semiconductor wafer by said second blade along said dicing line following said first dicing step, and for cutting the bottom of said first groove for forming a second groove deeper than said first groove in said silicon substrate along said dicing line.
2. The method of manufacturing a semiconductor device according to claim 1 , wherein, in said second dicing step, a silicon wafer is divided into a plurality of semiconductor chips.
3. The method of manufacturing a semiconductor device according to claim 1 , wherein said second insulating layer is comprised of a SIOC film.
4. The method of manufacturing a semiconductor device according to claim 1 , wherein said second insulating layer is comprised of a material selected from a group of SIOF film, SILK film, SiCN film, SiO 2 film containing a methyl group, and MSQ (Methyl Silses Quioxane).
5. The method of manufacturing a semiconductor device according to claim 1 , wherein said second width of said first blade is equal to or less than 40% of said first width.
6. The method of manufacturing a semiconductor device according to claim 1 , wherein said first blade is a metal-bond blade in which abrasive particles are combined by metal as a bond.
7. The method of manufacturing a semiconductor device according to claim 1 , wherein said second blade is a metal-bond blade in which abrasive particles are combined by metal as a bond, and a fineness number of abrasive particles of said second blade is smaller than a fineness number of abrasive particles of said first blade.
8. A method of manufacturing a semiconductor device comprising the steps of:
(a) preparing a semiconductor wafer having a plurality of semiconductor chip regions divided by a plurality of dicing lines, said semiconductor wafer including
a silicon substrate in which a plurality of grooves are formed on the surface thereof for element separation,
a plurality of transistors formed in respective regions separated by said grooves for element separation,
a first insulating layer of a silicon oxide film formed on said plurality of transistors,
a plurality of wiring layers formed on said first insulating layer,
at least a second insulating layer formed in between said plurality of wiring layers, said second insulating layer having lower dielectric constant than said silicon oxide film, said second insulating layer extending onto said dicing lines,
(b) preparing a first blade and a second blade,
said first blade including a first portion of a first width and a second portion formed integrally with said first portion, said second portion being formed in a V character shape and having an edge point of second width smaller than the first width,
said second blade having a third width smaller than said first width and larger than said second width,
(c) a first dicing step for cuffing said semiconductor wafer by said first blade along said dicing line, and for making said first portion of said first blade reach into said silicon substrate and to form a first groove in said silicon substrate along said dicing line,
(d) a second dicing step for cuffing said semiconductor wafer by said second blade along said dicing line following said first dicing step, and for cutting the bottom of said first groove for forming a second groove deeper than said first groove in said silicon substrate along said dicing line.
9. The method of manufacturing a semiconductor device according to claim 1 , wherein, in said second dicing step, a silicon wafer is divided into a plurality of semiconductor chips.
10. The method of manufacturing a semiconductor device according to claim 8 , wherein said second insulating layer is comprised of a SIOC film.
11. The method of manufacturing a semiconductor device according to claim 8 , wherein said second insulating layer is comprised of a material selected from a group of SIOF film, SILK film, SiCN film, SiO 2 film containing a methyl group, and MSQ (Methyl Silses Quioxane).
12. The method of manufacturing a semiconductor device according to claim 8 , wherein said second width of said first blade is equal to or less than 40% of said first width.
13. The method of manufacturing a semiconductor device according to claim 8 , wherein said first blade is a metal-bond blade in which abrasive particles are combined by metal as a bond.
14. The method of manufacturing a semiconductor device according to claim 8 , wherein said second blade is a metal-bond blade in which abrasive particles are combined by metal as a bond, and a fineness number of abrasive particles of said second blade is smaller than a fineness number of abrasive particles of said first blade.