Semiconductor device
The present invention provides a semiconductor device capable of suppressing degradation in connection reliability due to the decrease in thickness of a conductive adhesive caused by the movement of a connecting plate in a semiconductor device to which a power transistor is mounted. A step is provided in the thin part of the connecting plate connected to a lead post to lock the connecting plate by contacting the step to the tip of the lead post. Alternatively, a groove is provided in the thin part of the connecting plate to lock the connecting plate by connecting the lead post to only the part of the connecting plate on the tip side from the groove.
1 . A semiconductor device comprising a connecting plate which electrically connects a first electrode and a second electrode,
wherein a step is provided in a connection portion of said connecting plate where said connecting plate is connected to said first electrode or said second electrode, said first electrode or said second electrode and said step are connected by a conductive adhesive, and said connecting plate is locked to said first electrode or said second electrode by said step.
2 . A semiconductor device comprising a connecting plate which electrically connects a first electrode and a second electrode,
wherein a groove is provided in a connection portion of said connecting plate where said connecting plate is connected to said first electrode or said second electrode, said first electrode or said second electrode and an area of the connecting plate outside said groove are connected by a conductive adhesive, and said connecting plate is locked to said first electrode or said second electrode.
3 . A semiconductor device comprising:
a semiconductor chip having a main surface and a rear surface which are in opposite sides to each other, a first electrode provided on said rear surface and a second electrode provided on said main surface;
a supporting substrate to which the first electrode of said semiconductor chip is bonded via a first adhesive;
a lead disposed around said semiconductor chip; and
a connecting plate bonded to the second electrode of said semiconductor chip via a second adhesive and to said lead via a third adhesive,
wherein a step for suppressing movement of said connecting plate toward a lead side due to wetting and spreading and condensation of said third adhesive is provided in said connecting plate.
4 . A semiconductor device comprising:
a semiconductor chip having a main surface and a rear surface which are in opposite sides to each other, a first electrode provided on said rear surface and a second electrode provided on said main surface;
a supporting substrate to which the first electrode of said semiconductor chip is bonded via a first adhesive;
a lead disposed around said semiconductor chip; and
a connecting plate bonded to the second electrode of said semiconductor chip via a second adhesive and to said lead via a third adhesive,
wherein a groove for suppressing movement of said connecting plate toward a lead side due to wetting and spreading and condensation of said third adhesive is provided in said connecting plate.
5 . The semiconductor device according to claim 3 ,
wherein said connecting plate has a thick part connected to the second electrode of said semiconductor chip and a thin part connected to said thick part and said lead,
an upper surface of said thick part and said thin part is flat, and
said step is provided on a lower surface side of the thin part of said connecting plate.
6 . The semiconductor device according to claim 4 ,
wherein said connecting plate has a thick part connected to the second electrode of said semiconductor chip and a thin part connected to said thick part and said lead,
an upper surface of said thick part and said thin part is flat, and
said groove is provided on a lower surface side of the thin part of said connecting plate.
7 . The semiconductor device according to claim 3 ,
wherein said first to third adhesives are solder.
8 . The semiconductor device according to claim 4 ,
wherein said first to third adhesives are solder.
9 . The semiconductor device according to claim 3 ,
wherein a tip of said lead is a wider lead post, and
said connecting plate is connected to said lead post.
10 . The semiconductor device according to claim 4 ,
wherein a tip of said lead is a wider lead post, and
said connecting plate is connected to said lead post.
11 . The semiconductor device according to claim 3 ,
wherein said supporting substrate, said semiconductor chip, said lead and said connecting plate are sealed by a sealing body made of resin,
said lead protrudes from a side of said sealing body, and
said supporting substrate is exposed at a lower surface of said sealing body.
12 . The semiconductor device according to claim 4 ,
wherein said supporting substrate, said semiconductor chip, said lead and said connecting plate are sealed by a sealing body made of resin,
said lead protrudes from a side of said sealing body, and
said supporting substrate is exposed at a lower surface of said sealing body.