IP Library Patent Application 11642663
Patent Application
App. No. 11/642,663

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

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Quick Facts
Patent No.
US None
App. No.
11/642,663
Abstract

A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

Claims (81)

1 . A process for forming a solar cell conductive feature, comprising:

(a) providing a precursor composition comprising a powder, the powder comprising first metallic nanoparticles and having a bimodal particle size distribution, wherein the first metallic nanoparticles comprise a first metal;

(b) direct printing the precursor composition onto the substrate; and

(c) heating the precursor composition to form the solar cell conductive feature.

2 . The process of claim 1 , wherein the direct printing comprises syringe printing.

3 . The process of claim 1 , wherein the direct printing comprises aerosol jet depositing.

4 . The process of claim 1 , wherein the direct printing comprises ink jet printing.

5 . The process of claim 4 , wherein the first metallic nanoparticles are spherical.

6 . The process of claim 4 , wherein the first metallic nanoparticles have an average particle size of not greater than 100 nanometers.

7 . The process of claim 4 , wherein the first metallic nanoparticles have an average particle size of from about 10 to 80 nanometers.

8 . The process of claim 4 , wherein the first metallic nanoparticles have an average particle size of from about 25 to 75 nanometers.

9 . The process of claim 4 , wherein the first metal is selected from the group consisting of silver, palladium, copper, gold, platinum and nickel.

10 . The process of claim 4 , wherein the precursor composition comprises a larger mode and a smaller mode.

11 . The process of claim 10 , wherein the larger mode and the smaller mode have different compositions.

12 . The process of claim 10 , wherein the larger mode comprises hollow or porous particles, and wherein the smaller mode comprises dense particles.

13 . The process of claim 10 , wherein the larger mode has an average particle size of from about 1 μm to 10 μm and the smaller mode has an average particle size of from about 10 to 100 nm.

14 . The process of claim 4 , wherein the powder further comprises second metallic nanoparticles comprising a metal oxide.

15 . The process of claim 14 , wherein the metal oxide acts as an adhesion promoter.

16 . The process of claim 14 , wherein the metal oxide comprises silica, copper oxide, aluminum oxide or titania.

17 . The process of claim 14 , wherein the metal oxide comprises silica, copper oxide, aluminum oxide or titania.

18 . The process of claim 14 , wherein the metal oxide comprises glass.

19 . The process of claim 14 , wherein the metal oxide comprises a conductive metal oxide.

20 . The process of claim 19 , wherein the conductive metal oxide comprises In 2 O 3 , indium-tin oxide, or antimony-tin oxide.

21 . The process of claim 14 , wherein the metal oxide comprises pyrogenous silica or surface modified silica.

22 . The process of claim 14 , wherein the metal oxide comprises aluminum borosilicate or lead borosilicate.

23 . The process of claim 4 , wherein the powder further comprises second metallic nanoparticles comprising a second metal.

24 . The process of claim 23 , wherein the second metal is selected from the group consisting of silver, palladium, copper, gold, platinum and nickel.

25 . The process of claim 23 , wherein the conductive feature comprises an alloy of the first metal and the second metal.

26 . The process of claim 4 , wherein the heating comprises heating the precursor composition to a temperature not greater than 225° C. to form the solar cell conductive feature on the substrate.

27 . The process of claim 4 , wherein the heating comprises heating the precursor composition to a temperature not greater than 185° C. to form the solar cell conductive feature on the substrate.

28 . The process of claim 4 , wherein the substrate has a softening point of not greater than about 225° C.

29 . The process of claim 4 , wherein the substrate comprises a polymer.

30 . The process of claim 4 , wherein the substrate comprises a ceramic.

31 . The process of claim 4 , wherein the conductive feature comprises a set of finger lines and collector lines deposited essentially at a right angle to the finger lines.

32 . The process of claim 31 , wherein either or both the parallel finger lines or the collector lines have a width not greater than 200 μm.

33 . The process of claim 31 , wherein either or both the parallel finger lines or the collector lines have a width not greater than 100 μm.

34 . The process of claim 4 , wherein the conductive feature has a thickness greater than 1 μm.

35 . The process of claim 4 , wherein the conductive feature has a thickness greater than 5 μm.

36 . The process of claim 4 , wherein the conductive feature comprises a transparent conductive feature.

37 . The process of claim 4 , wherein the conductive feature comprises indium-tin oxide or antimony-tin oxide.

38 . The process of claim 4 , wherein the first metallic nanoparticles have a volume median particle size of not greater than 100 nm.

39 . The process of claim 38 , wherein the first metallic nanoparticles comprise a cap or coating thereon.

40 . The process of claim 39 , wherein the cap or coating comprises an inorganic cap or coating.

41 . The process of claim 39 , wherein the cap or coating comprises silica.

42 . The process of claim 39 , wherein the cap or coating comprises glass.

43 . The process of claim 39 , wherein the cap or coating comprises an organic cap or coating.

44 . The process of claim 39 , wherein the cap or coating comprises a polymer.

45 . The process of claim 39 , wherein the cap or coating comprises an intrinsically conductive polymer, a sulfonated perfluorohydrocarbon polymer, polystyrene, polystyrene/methacrylate, sodium bis(2-ethylhexyl)sulfosuccinate, tetra-n-octyl-ammonium bromide or an alkane thiolate.

46 . The process of claim 39 , wherein the cap or coating comprises PVP.

47 . The process of claim 4 , wherein the conductivity of the conductive feature is no less than 10 percent the conductivity of the pure silver.

48 . The process of claim 4 , wherein the conductive feature has a resistivity that is not greater than 4 times the resistivity of pure silver.

49 . The process of claim 4 , wherein the conductive feature has a resistivity that is not greater than 2 times the resistivity of pure silver.

50 . The process of claim 4 , wherein the conductive feature is resistant to solder leaching.

51 . The process of claim 4 , wherein the process further comprises high shear mixing the precursor composition.

52 . The process of claim 4 , wherein the process further comprises surface modifying the substrate with a laser.

53 . A precursor composition suitable for ink jet printing, the precursor composition comprising a powder and a liquid vehicle, wherein the powder comprises first metallic nanoparticles and has a bimodal particle size distribution, the first metallic nanoparticles comprising a first metal.

54 . The precursor composition of claim 53 , wherein the precursor composition has a viscosity not greater than about 100 centipoise.

55 . The precursor composition of claim 53 , wherein the precursor composition has a viscosity not greater than about 50 centipoise.

56 . The precursor composition of claim 53 , wherein the first metallic nanoparticles are spherical.

57 . The precursor composition of claim 53 , wherein the first metallic nanoparticles have an average particle size of not greater than 100 nanometers.

58 . The precursor composition of claim 53 , wherein the first metallic nanoparticles have an average particle size of from about 10 to 80 nanometers.

59 . The precursor composition of claim 53 , wherein the first metallic nanoparticles have an average particle size of from about 25 to 75 nanometers.

60 . The precursor composition of claim 53 , wherein the powder further comprises second metallic nanoparticles comprising a second metal or a metal oxide.

61 . The precursor composition of claim 60 , wherein the second metallic nanoparticles comprise the second metal.

62 . The precursor composition of claim 60 , wherein the second metal is selected from the group consisting of silver, palladium, copper, gold, platinum and nickel.

63 . The precursor composition of claim 60 , wherein the second metallic nanoparticles comprise the metal oxide.

64 . The precursor composition of claim 63 , wherein the metal oxide comprises silica, copper oxide, aluminum oxide or titania.

65 . The precursor composition of claim 63 , wherein the metal oxide comprises glass.

66 . The precursor composition of claim 63 , wherein the metal oxide comprises a conductive metal oxide.

67 . The precursor composition of claim 66 , wherein the conductive metal oxide comprises In 2 O 3 , indium-tin oxide, or antimony-tin oxide.

68 . The precursor composition of claim 63 , wherein the metal oxide comprises pyrogenous silica or surface modified silica.

69 . The precursor composition of claim 63 , wherein the metal oxide comprises aluminum borosilicate or lead borosilicate.

70 . The precursor composition of claim 53 , wherein the first metal is selected from the group consisting of silver, palladium, copper, gold, platinum and nickel.

71 . The precursor composition of claim 53 , wherein the first metallic particles comprise silver particles having a cap or coating thereon.

72 . The precursor composition of claim 71 , wherein the cap or coating comprises an inorganic cap or coating.

73 . The precursor composition of claim 71 , wherein the cap or coating comprises silica.

74 . The precursor composition of claim 71 , wherein the cap or coating comprises glass.

75 . The precursor composition of claim 71 , wherein the cap or coating comprises an organic cap or coating.

76 . The precursor composition of claim 71 , wherein the cap or coating comprises a polymer.

77 . The precursor composition of claim 71 , wherein the cap or coating comprises an intrinsically conductive polymer, a sulfonated perfluorohydrocarbon polymer, polystyrene, polystyrene/methacrylate, sodium bis(2-ethylhexyl) sulfosuccinate, tetra-n-octyl-ammonium bromide or an alkane thiolate.

78 . The precursor composition of claim 71 , wherein the cap or coating comprises PVP.