Low viscosity precursor compositions and methods for the deposition of conductive electronic features
A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
1 . A process for forming a flat panel display conductive feature, comprising:
(a) direct printing a precursor composition onto a substrate, the precursor composition comprising metallic particles, the metallic particles comprising a metallic core and a coating disposed thereon; and
(b) heating the precursor composition to form the flat panel display conductive feature on the substrate.
2 . The process of claim 1 , wherein the direct printing comprises syringe printing.
3 . The process of claim 1 , wherein the direct printing comprises aerosol jet deposition.
4 . The process of claim 1 , wherein the direct printing comprises ink jet printing.
5 . The process of claim 4 , wherein the coating comprises an inorganic compound.
6 . The process of claim 4 , wherein the coating comprises a metal oxide.
7 . The process of claim 4 , wherein the coating comprises silica.
8 . The process of claim 4 , wherein the coating comprises an elemental metal.
9 . The process of claim 4 , wherein the coating comprises an organic compound.
10 . The process of claim 4 , wherein the cap or coating comprises a polymer.
11 . The process of claim 4 , wherein the coating comprises PVP.
12 . The process of claim 4 , wherein the coating comprises a conductive polymer.
13 . The process of claim 4 , wherein the coating comprises a compound selected from the group consisting of: sulfonated perfluorohydrocarbon polymer, polystyrene, polystyrene/methacrylate, sodium bis(2-ethylhexyl) sulfosuccinate, tetra-n-octyl-ammonium bromide and alkane thiolates.
14 . The process of claim 4 , wherein core comprises a conductive metal oxide.
15 . The process of claim 4 , wherein core comprises a metal selected from the group consisting of silver, palladium, copper, gold, platinum and nickel.
16 . The process of claim 15 , wherein the coating comprises silica.
17 . The process of claim 15 , wherein the coating comprises glass.
18 . The process of claim 4 , wherein the metallic particles have a volume median particle size of not greater than 100 nm.
19 . The process of claim 4 , wherein the metallic particles have a volume median particle size of not greater than 0.3 μm.
20 . The process of claim 4 , wherein the coating has a thickness of not greater than about 100 nm.
21 . The process of claim 4 , wherein the coating has a thickness of not greater than about 50 nm.
22 . The process of claim 4 , wherein the coating has a thickness of not greater than about 5 nm.
23 . The process of claim 4 , wherein the coating enhances bonding of the particles to the substrate.
24 . The process of claim 4 , wherein the coating prevents agglomeration of the metallic particles while in the precursor composition.
25 . The process of claim 4 , wherein the heating sinters adjacent particles to one another.
26 . The process of claim 4 , wherein the heating comprises heating in air at from about 450° C. to 600° C.
27 . The process of claim 4 , wherein the substrate comprises glass.
28 . The process of claim 4 , wherein the substrate comprises a polymer.
29 . The process of claim 4 , wherein the flat panel display conductive feature comprises an electrode.
30 . The process of claim 4 , wherein the flat panel display conductive feature comprises a bus line.
31 . The process of claim 4 , wherein the flat panel display conductive feature comprises a transparent conductive feature.
32 . The process of claim 4 , wherein the flat panel display conductive feature comprises indium-tin oxide or antimony-tin oxide.
33 . The process of claim 4 , wherein the flat panel display conductive feature has a width less than 200 μm.
34 . The process of claim 4 , wherein the flat panel display conductive feature has a width less than 100 μm.
35 . The process of claim 4 , wherein the flat panel display conductive feature has a thickness greater than 1 μm.
36 . The process of claim 4 , wherein the flat panel display conductive feature has a thickness greater than 5 μm.
37 . The process of claim 4 , wherein the precursor composition further comprises glass particles.
38 . The process of claim 4 , wherein the flat panel display conductive feature comprises a metal-glass composition.
39 . The process of claim 4 , wherein the process further comprises high shear mixing the precursor composition.
40 . The process of claim 4 , wherein the process further comprises surface modifying the substrate with a laser.
41 . A process for forming a flat panel display conductive feature for a flat panel display, the process comprising heating an ink jet printed precursor composition to form the flat panel display conductive feature on a substrate, wherein the precursor composition comprises metallic particles having a core comprising a metal and a coating disposed on the core.
42 . The process of claim 41 , wherein the coating comprises an inorganic compound.
43 . The process of claim 41 , wherein the coating comprises a metal oxide.
44 . The process of claim 41 , wherein the coating comprises silica.
45 . The process of claim 41 , wherein the coating comprises glass.
46 . The process of claim 41 , wherein the coating comprises an elemental metal.
47 . The process of claim 41 , wherein the coating comprises an organic compound.
48 . The process of claim 41 , wherein the cap or coating comprises a polymer.
49 . The process of claim 41 , wherein the coating comprises PVP.
50 . The process of claim 41 , wherein the coating comprises a conductive polymer.
51 . The process of claim 41 , wherein the coating comprises a compound selected from the group consisting of: sulfonated perfluorohydrocarbon polymer, polystyrene, polystyrene/methacrylate, sodium bis(2-ethylhexyl) sulfosuccinate, tetra-n-octyl-ammonium bromide and alkane thiolates.
52 . The process of claim 41 , wherein core comprises a conductive metal oxide.
53 . The process of claim 41 , wherein the metal is selected from the group consisting of silver, palladium, copper, gold, platinum and nickel.
54 . The process of claim 53 , wherein the coating comprises silica.
55 . The process of claim 53 , wherein the coating comprises glass.
56 . The process of claim 41 , wherein the metallic particles have a volume median particle size of not greater than 100 nm.
57 . The process of claim 41 , wherein the metallic particles have a volume median particle size of not greater than 0.3 μm.
58 . The process of claim 41 , wherein the coating has a thickness of not greater than about 100 nm.
59 . The process of claim 41 , wherein the coating has a thickness of not greater than about 50 nm.
60 . The process of claim 41 , wherein the coating has a thickness of not greater than about 5 nm.
61 . The process of claim 41 , wherein the coating enhances bonding of the particles to the substrate.
62 . The process of claim 41 , wherein the coating prevents agglomeration of the metallic particles while in the precursor composition.
63 . The process of claim 41 , wherein the heating sinters adjacent particles to one another.
64 . The process of claim 41 , wherein the heating comprises heating in air at from about 450° C. to 600° C.
65 . The process of claim 41 , wherein the substrate comprises glass.
66 . The process of claim 41 , wherein the substrate comprises a polymer.
67 . The process of claim 41 , wherein the flat panel display conductive feature comprises an electrode.
68 . The process of claim 41 , wherein the flat panel display conductive feature comprises a bus line.
69 . The process of claim 41 , wherein the flat panel display conductive feature comprises a transparent conductive feature.
70 . The process of claim 41 , wherein the flat panel display conductive feature comprises indium-tin oxide or antimony-tin oxide.
71 . The process of claim 41 , wherein the flat panel display conductive feature has a width less than 200 μm.
72 . The process of claim 41 , wherein the flat panel display conductive feature has a width less than 100 μm.
73 . The process of claim 41 , wherein the flat panel display conductive feature has a thickness greater than 1 μm.
74 . The process of claim 41 , wherein the flat panel display conductive feature has a thickness greater than 5 μm.
75 . The process of claim 41 , wherein the precursor composition further comprises glass particles.
76 . The process of claim 41 , wherein the flat panel display conductive feature comprises a metal-glass composition.
77 . The process of claim 41 , wherein the process further comprises high shear mixing the precursor composition.
78 . The process of claim 41 , wherein the process further comprises surface modifying the substrate with a laser.