Low viscosity precursor compositions and methods for the deposition of conductive electronic features
A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.
1 . A process for forming a flat panel display conductive feature, comprising:
(a) direct printing a precursor composition onto a substrate, wherein the precursor composition comprises metallic particles and glass particles;
(b) heating the precursor composition to form the flat panel display conductive feature on the substrate.
2 . The process of claim 1 , wherein the direct printing comprises syringe printing.
3 . The process of claim 1 , wherein the direct printing comprises aerosol jet deposition.
4 . The process of claim 1 , wherein the direct printing comprises ink jet printing.
5 . The process of claim 4 , wherein the glass particles comprise glass nanoparticles.
6 . The process of claim 4 , wherein the glass particles comprise barium aluminum borosilicate, calcium silicate or lead borosilicate.
7 . The process of claim 4 , wherein the glass particles comprise silver phosphate glass.
8 . The process of claim 4 , wherein the precursor composition comprises the glass particles in an amount up to 10 volume percent.
9 . The process of claim 4 , wherein the metallic particles comprise a metal oxide.
10 . The process of claim 4 , wherein the metallic particles comprises a metal selected from the group consisting of silver, palladium, copper, gold, platinum and nickel.
11 . The process of claim 4 , wherein the metallic particles have a volume median particle size of not greater than 100 nm.
12 . The process of claim 4 , wherein the metallic particles have a volume median particle size of not greater than 0.3 μm.
13 . The process of claim 12 , wherein the silver particles comprise a cap or coating thereon.
14 . The process of claim 13 , wherein the cap or coating comprises an inorganic cap or coating.
15 . The process of claim 13 , wherein the cap or coating comprises silica.
16 . The process of claim 13 , wherein the cap or coating comprises glass.
17 . The process of claim 13 , wherein the cap or coating comprises an organic cap or coating.
18 . The process of claim 13 , wherein the cap or coating comprises a polymer.
19 . The process of claim 13 , wherein the cap or coating comprises an intrinsically conductive polymer, a sulfonated perfluorohydrocarbon polymer, polystyrene, polystyrene/methacrylate, sodium bis(2-ethylhexyl) sulfosuccinate, tetra-n-octyl-ammonium bromide or an alkane thiolate.
20 . The process of claim 13 , wherein the cap or coating comprises PVP.
21 . The process of claim 4 , wherein the heating comprises heating in air at from about 450° C. to 600° C.
22 . The process of claim 4 , wherein the substrate comprises glass.
23 . The process of claim 4 , wherein the substrate comprises a polymer.
24 . The process of claim 4 , wherein the flat panel display conductive feature comprises an electrode.
25 . The process of claim 4 , wherein the flat panel display conductive feature comprises a bus line.
26 . The process of claim 4 , wherein the flat panel display conductive feature comprises a transparent conductive feature.
27 . The process of claim 4 , wherein the flat panel display conductive feature comprises indium-tin oxide or antimony-tin oxide.
28 . The process of claim 4 , wherein the flat panel display conductive feature has a width less than 200 μm.
29 . The process of claim 4 , wherein the flat panel display conductive feature has a width less than 100 μm.
30 . The process of claim 4 , wherein the flat panel display conductive feature has a thickness greater than 1 μm.
31 . The process of claim 4 , wherein the flat panel display conductive feature has a thickness greater than 5 μm.
32 . The process of claim 4 , wherein the flat panel display conductive feature comprises a metal-glass composition.
33 . The process of claim 4 , wherein the process further comprises high shear mixing the precursor composition.
34 . The process of claim 4 , wherein the process further comprises surface modifying the substrate with a laser.
35 . A process for forming a flat panel display conductive feature, the process comprising heating an ink jet printed precursor composition to form the flat panel display conductive feature on a substrate, wherein the precursor composition comprises metallic particles and glass particles.
36 . The process of claim 35 , wherein the glass particles comprise glass nanoparticles.
37 . The process of claim 35 , wherein the glass particles comprise barium aluminum borosilicate, calcium silicate or lead borosilicate.
38 . The process of claim 35 , wherein the glass particles comprise silver phosphate glass.
39 . The process of claim 35 , wherein the precursor composition comprises the glass particles in an amount up to 10 volume percent.
40 . The process of claim 35 , wherein the metallic particles comprise a metal oxide.
41 . The process of claim 35 , wherein the metallic particles comprises a metal selected from the group consisting of silver, palladium, copper, gold, platinum and nickel.
42 . The process of claim 35 , wherein the metallic particles have a volume median particle size of not greater than 100 nm.
43 . The process of claim 35 , wherein the metallic particles have a volume median particle size of not greater than 0.3 μm.
44 . The process of claim 43 , wherein the silver particles comprise a cap or coating thereon.
45 . The process of claim 44 , wherein the cap or coating comprises an inorganic cap or coating.
46 . The process of claim 44 , wherein the cap or coating comprises silica.
47 . The process of claim 44 , wherein the cap or coating comprises glass.
48 . The process of claim 44 , wherein the cap or coating comprises an organic cap or coating.
49 . The process of claim 44 , wherein the cap or coating comprises a polymer.
50 . The process of claim 44 , wherein the cap or coating comprises an intrinsically conductive polymer, a sulfonated perfluorohydrocarbon polymer, polystyrene, polystyrene/methacrylate, sodium bis(2-ethylhexyl) sulfosuccinate, tetra-n-octyl-ammonium bromide or an alkane thiolate.
51 . The process of claim 44 , wherein the cap or coating comprises PVP.
52 . The process of claim 35 , wherein the heating comprises heating in air at from about 450° C. to 600° C.
53 . The process of claim 35 , wherein the substrate comprises glass.
54 . The process of claim 35 , wherein the substrate comprises a polymer.
55 . The process of claim 35 , wherein the flat panel display conductive feature comprises an electrode.
56 . The process of claim 35 , wherein the flat panel display conductive feature comprises a bus line.
57 . The process of claim 35 , wherein the flat panel display conductive feature comprises a transparent conductive feature.
58 . The process of claim 35 , wherein the flat panel display conductive feature comprises indium-tin oxide or antimony-tin oxide.
59 . The process of claim 35 , wherein the flat panel display conductive feature has a width less than 200 μm.
60 . The process of claim 35 , wherein the flat panel display conductive feature has a width less than 100 μm.
61 . The process of claim 35 , wherein the flat panel display conductive feature has a thickness greater than 1 μm.
62 . The process of claim 35 , wherein the flat panel display conductive feature has a thickness greater than 5 μm.
63 . The process of claim 35 , wherein the flat panel display conductive feature comprises a metal-glass composition.
64 . The process of claim 35 , wherein substrate was surface modified with a laser.