Flip chip shielded RF I/O land grid array package
View Patent ↗A novel apparatus and method for providing a radio frequency (“RF”) input/output (“I/O”) land grid array (“LGA”) package structure. The package structure comprises grounded shield rings surrounding free-standing RF I/O interconnects. The free-standing RF I/O interconnects eliminate long leads and the shield rings provide ground protection thereby minimizing losses, inductance, leakage, and crosstalk, and improving performance.
1. A shielded land grid array package, comprising:
a lead-frame substrate defining at least one free-standing radio frequency (RF) interconnect surrounded by at least one shield ring, the at least one free-standing RF interconnect being held in place by a first encapsulate;
at least one flip chip mounted to the at least one free-standing RF interconnect wherein a flip chip RF lead couples to the at least one free-standing RF interconnect and a flip chip ground lead couples to the shield ring; and
a second encapsulate disposed over the lead frame substrate, the at least one free-standing RF interconnect, and the at least one flip chip.
2. The package of claim 1 , wherein the lead-frame substrate is made of a metal selected from the group consisting of copper, copper alloy, nickel-iron alloy, and nickel-cobalt alloy.
3. The package of claim 1 , further comprising a slot in a surface of the lead-frame substrate for facilitating bonding of the second encapsulate.
4. The package of claim 1 , wherein the shield ring is defined as a continuous shield ring.
5. The package of claim 1 , wherein the shield ring is defined as a split shield ring.
6. The package of claim 1 , wherein the shield ring is circular in shape.
7. The package of claim 1 , wherein the shield ring is polygonal in shape.
8. The package of claim 1 , wherein the flip chip is an Integrated Circuit (IC).
9. The package of claim 1 , further comprising at least one package component mounted to the lead-frame substrate.
10. The package of claim 1 , further comprising an underfill disposed between the lead-frame substrate and the at least one flip chip.
11. The package of claim 1 , further comprising a third encapsulate disposed between the lead frame substrate and the at least one flip chip.
12. The package of claim 1 , further comprising at least one heat sink on the at least one flip chip.
13. The package of claim 1 , wherein the first encapsulate comprises a same material as the second encapsulate.
14. The package of claim 1 , wherein the first encapsulate comprises a different material from the second encapsulate.