Adhesive compositions for bonding metals
A two-part structural adhesive composition particularly for use with metals comprising one or more vinyl monomers, preferably an acrylate or methacrylate ester monomer, one or more soluble or dispersible polymers, and acetylenic diol adhesion promoter, and preferably one or more polymerizable acid adhesion promoters.
1 . An adhesive composition comprising one or more vinyl monomers, one or more soluble or dispersible polymers, and an acetylenic diol adhesion promoter.
2 . The adhesive composition of claim 1 further comprising a polymerizable acidic adhesion promoter.
3 . The adhesive composition of claim 1 wherein the acetylenic diol comprises
wherein R 1 , R 2 , R 3 , and R 4 are selected from H and alkyl groups and wherein n is equal to or greater than 0.
4 . The adhesive composition of claim 1 , wherein the acetylenic diol adhesion promoter comprises 2-butyne-1,4-diol.
5 . The adhesive composition of claim 1 , wherein the acetylenic diol adhesion promoter comprises 2,4,7,9-tetramethyl-5-decyne-4,7-diol.
6 . The adhesive composition of claim 1 , wherein the acetylenic diol adhesion promoter comprises an ethoxylated 2-butyne-1,4-diol.
7 . An organic adhesive composition comprising an acrylate or methacrylate ester monomer, a soluble or dispersible polymer, an acetylenic diol adhesion promoter and a polymerizable acidic adhesion promoter.
8 . The adhesive composition of claim 7 wherein the acetylenic diol comprises
wherein R 1 , R 2 , R 3 , and R 4 are selected from H and alkyl groups and wherein n is equal to or greater than 0.
9 . The organic adhesive composition of claim 8 , wherein the acetylenic diol adhesion promoter comprises 2-butyne-1,4-diol.
10 . The organic adhesive composition of claim 8 , wherein the acetylenic diol adhesion promoter comprises 2,4,7,9-tetramethyl-5-decyne-4,7-diol.
11 . The organic adhesive composition of claim 8 , wherein the acetylenic diol adhesion promoter comprises an ethoxylated 2-butyne-1,4-diol.
12 . The adhesive composition of claim 2 wherein the acidic adhesion promoter is selected from the group consisting of unsaturated mono-carboxylic acids, such as acrylic acid and methacrylic acid, unsaturated dicarboxylic acids, such as maleic acid and fumaric acid, unsaturated phosphoric acid esters, such as mono- and bis-methacroyloxyethyl phosphate and mixtures thereof.
13 . The organic adhesive composition of claim 7 wherein the acidic adhesion promoter is selected from the group consisting of unsaturated mono-carboxylic acids, such as acrylic acid and methacrylic acid, unsaturated dicarboxylic acids, such as maleic acid and fumaric acid, unsaturated phosphoric acid esters, such as mono- and bis-methacroyloxyethyl phosphate and mixtures thereof.
14 . An organic adhesive composition comprising from about 20 to about 90% of a polymerizable vinyl monomer, from about 10% to about 60% of a soluble or dispersible polymer or mixture of polymers, and from about 0.1 to about 10% of an acetylenic diol.
15 . The adhesive composition of claim 14 wherein the acetylenic diol comprises
wherein R 1 , R 2 , R 3 , and R 4 are selected from H and alkyl groups and wherein n is equal to or greater than 0.
16 . The adhesive composition of claim 14 , wherein the acetylenic diol adhesion promoter comprises 2-butyne-i,4-diol.
17 . The composition of claim 14 further comprising from about 0.5 to about 20% of a polymerizable acidic adhesion promoter.
18 . The adhesive composition of claim 14 , wherein the acetylenic diol adhesion promoter comprises 2,4,7,9-tetramethyl-5-decyne-4,7-diol.
19 . The adhesive composition of claim 14 , wherein the acetylenic diol adhesion promoter comprises an ethoxylated 2-butyne-1,4-diol.
20 . The adhesive composition of claim 14 wherein the acidic adhesion promoter is selected from the group consisting of unsaturated mono-carboxylic acids, such as acrylic acid and methacrylic acid, unsaturated dicarboxylic acids, such as maleic acid and fumaric acid, unsaturated phosphoric acid esters, such as mono- and bis-methacroyloxyethyl phosphate and mixtures thereof.
21 . A process of adhesively securing metallic substrates comprising
a) preparing the adhesive composition of claim 1 , and
b) securing the adhesive composition to metallic substrates.