IP Library Granted Patent US 7,803,216
Granted Patent B2
US 7,803,216 · App. 11/643,671 · Granted Sep 28, 2010

Pressurized high-temperature gas cooler

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Quick Facts
Patent No.
US 7,803,216
App. No.
11/643,671
Granted
Sep 28, 2010
Kind
B2
Abstract

A compact pressurized high-temperature gas cooler having superior heat exchange performance and excellent economical efficiency is provided. A return-flow structure is formed in which a flue through which high-temperature gas flows is formed in a pressure container, a heat exchanger is disposed in the flue, and a partition dividing the internal cross-sectional area of the flue is provided so that the high-temperature gas supplied from a bottom or a top portion of the pressure container flows back in a return direction. The cross-sectional-area division ratio dividing the internal cross-section of the flue is set so that the flow rate of the high-temperature gas flowing in one direction matches that flowing in the direction opposite thereto.

Claims (13)

1. A pressurized high-temperature gas cooler comprising a return-flow structure in which a flue through which high-temperature gas flows is formed in a pressure container, a heat exchanger is provided in the flue, and a partition is provided to divide an internal cross-section of the flue so that the high-temperature gas supplied from a bottom portion or a top portion of the pressure container flows back in a return direction,

wherein a cross-sectional-area division ratio at which the internal cross-section of the flue is divided is set so that flow rates of the high-temperature gas in opposite directions substantially match each other.

2. The pressurized high-temperature gas cooler according to claim 1 , wherein the return-flow structure is formed so that high-temperature gas supplied from a gas inlet provided at a top portion of the pressure container flows back and out through a gas outlet provided at an upper portion, and the length of a produced-gas pipe connecting the gas outlet and a gas inlet of a char collection device disposed above the pressurized high-temperature gas cooler is shortened as much as possible.

3. The pressurized high-temperature gas cooler according to claim 1 , wherein the return-flow structure is formed so that a cross-sectional-area division ratio of a gas descending portion in which the high-temperature gas flows from the top to the bottom is set to be larger than that of a gas ascending portion in which the high-temperature gas flows back from the bottom to the top.

4. The pressurized high-temperature gas cooler according to claim 2 , wherein a char separation unit roughly separating char contained in the high-temperature gas is provided at a gas-return portion of the flue.

5. The pressurized high-temperature gas cooler according to claim 4 , wherein the char separation unit is an enlarged cross-sectional-area portion of the gas-return portion.

6. The pressurized high-temperature gas cooler according to claim 4 , wherein the char separation unit is an inertial separation mechanism provided at the gas-return portion.

7. The pressurized high-temperature gas cooler according to claim 3 , wherein a char separation unit roughly separating char contained in the high-temperature gas is provided at a gas-return portion of the flue.

8. The pressurized high-temperature gas cooler according to claim 7 , wherein the char separation unit is an enlarged cross-sectional-area portion of the gas-return portion.

9. The pressurized high-temperature gas cooler according to claim 7 , wherein the char separation unit is an inertial separation mechanism provided at the gas-return portion.

10. The pressurized high-temperature gas cooler according to claim 1 , wherein the pressure container has a circular cross-section.

11. The pressurized high-temperature gas cooler according to claim 1 , wherein the flue having a hexagonal cross-section is provided in the pressure container.

12. The pressurized high-temperature gas cooler according to claim 1 , wherein the flue is divided by a partition at a cross-sectional-area division ratio of 2 to 1.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVING PATENT APPLICATION NUMBER 11921683 PREVIOUSLY RECORDED AT REEL: 054975 FRAME: 0438. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 26, 2023
From: MITSUBISHI HITACHI POWER SYSTEMS, LTD.
To: MITSUBISHI POWER, LTD.
Reel/Frame 063787/0867 →
CHANGE OF NAME Recorded Jan 13, 2021
From: MITSUBISHI HITACHI POWER SYSTEMS, LTD.
To: MITSUBISHI POWER, LTD.
Reel/Frame 054975/0438 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2015
From: MITSUBISHI HEAVY INDUSTRIES, LTD.
To: MITSUBISHI HITACHI POWER SYSTEMS, LTD.
Reel/Frame 035101/0029 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2006
From: KOYAMA, YOSHINORI; YOKOHAMA, KATSUHIKO; SHINADA, OSAMU; ISHII, HIROMI; KITAGAWA, YUICHIRO; MANABE, KOSEI
To: MITSUBISHI HEAVY INDUSTRIES, LTD.
Reel/Frame 018743/0324 →