Organic light-emitting display device and method for fabricating the same
View Patent ↗Disclosed is an organic light-emitting display device capable of blocking the infiltration of oxygen and moisture and effectively preventing light leakage. The device includes a first substrate with first and second pixel regions wherein a plurality of organic light-emitting diodes are formed. The device further includes a non-pixel region around the first and the second pixel-regions, a second substrate disposed on the upper part of the first substrate to be overlapped with the first and the second pixel regions and a part of the non-pixel region, and a frit provided between the first and the second substrates to be overlapped with at least one of the first and the second pixel regions and at least a part of the non-pixel region. The first and the second substrates are adhered to each other by the fit in the part corresponding to the non-pixel region.
1. An organic light-emitting device comprising:
a first substrate;
a second substrate comprising an inner surface facing the first substrate, the inner surface comprising a first portion and a second portion;
a first array of light-emitting pixels interposed between the first substrate and the second substrate, said first array configured to emit light in at least a first direction;
a second array of light-emitting pixels interposed between the first substrate and the second substrate, said second array configured to emit light in at least a second direction;
a frit layer formed over the first portion of the inner surface while not formed over the second portion of the inner surface so as to block light scattered toward the second direction, wherein the first portion generally opposes the first array and the second portion generally opposes the second array; and
a frit seal interconnecting the first and second substrates while surrounding the first array and the second array such that the frit seal, the first substrate and the second substrate form an enclosed space where the first array and the second array are located.
2. The device of claim 1 , wherein the pixels of the first array are configured to emit light substantially through the first substrate.
3. The device of claim 1 , wherein the pixels of the second array are configured to emit light substantially through the second substrate.
4. The device of claim 3 , wherein the first portion of the inner surface extends over the entire first array.
5. The device of claim 1 , wherein a portion of the frit seal is adhered to the first substrate and the second substrate.
6. The device of claim 1 , wherein the frit comprises a glass material, and at least one of a filler material to adjust absorption characteristics, and a filler material to adjust thermal expansion characteristics.
7. The device of claim 1 , wherein the first substrate and the second substrate are transparent substrates.
8. The device of claim 1 , wherein the frit layer comprises a material that is non-transparent to visible light.
9. The device of claim 1 , wherein the first array is enclosed inside a first pixel area consisting of pixels configured to emit light in the first direction, and the second array is enclosed inside a second pixel area consisting of pixels configured to emit light in the second direction.
10. The device of claim 1 , wherein the frit layer is a continuous single layer.
11. The device of claim 1 , wherein the first substrate comprises a first display area on one side of the device, and the second substrate comprising a second display area on an opposite side of the device.
12. An organic light-emitting device comprising:
a first substrate;
a second substrate comprising an inner surface facing the first substrate, the inner surface comprising a first portion and a second portion, wherein a thickness of the second substrate in an inner portion comprising the first portion and the second portion is thinner than in an outer portion surrounding the inner portion;
a first array of light-emitting pixels interposed between the first substrate and the second substrate, said first array configured to emit light in at least a first direction;
a second array of light-emitting pixels interposed between the first substrate and the second substrate, said second array configured to emit light in at least a second direction;
a fit layer formed over the first portion of the inner surface while not formed over the second portion of the inner surface so as to block light scattered toward the second direction, wherein the first portion generally opposes the first array and the second portion generally opposes the second array; and
a fit seal formed over the outer portion interconnecting the first and second substrates while surrounding the first array and the second array such that the fit seal, the first substrate and the second substrate form an enclosed space where the first array and the second array are located.
13. The device of claim 12 , wherein the frit layer formed over the first portion of the inner surface and the fit seal formed over the outer portion have substantially same thickness.
14. The device of claim 12 , wherein the first portion of the inner surface extends over the entire first array.
15. A method of making an organic light-emitting device, the method comprising:
providing an unfinished device comprising a first substrate, wherein a first array of organic light emitting pixels and a second array of light emitting pixels are formed on the first substrate;
providing a second substrate, wherein the second substrate comprises a surface comprising a first portion and a second portion;
forming a frit layer over the first portion of the surface of the second substrate while not being formed over the second portion of the surface;
forming a peripheral fit on around edges of the second substrate;
placing the second substrate over the unfinished device such that the first substrate, the second substrate, and the peripheral frit form an enclosed space therein, wherein the first array and the second array are located in the enclosed space and the first portion generally extends over the first array and the second portion generally extends over the second array so as to block at least some of light scatter toward the first portion; and
melting and re-solidifying at least part of the peripheral frit so as to interconnect the unfinished device and the second substrate via the peripheral frit.
16. The method of claim 15 , wherein the peripheral frit is thicker than the frit layer formed over the first portion.
17. The method of claim 15 , wherein melting the peripheral frit comprises irradiating by laser or infrared rays.
18. The method of claim 17 , wherein the wavelength of the laser or the infrared rays are in a range from about 800 nm to about 1200 nm.
19. The method of claim 17 , further comprising masking at least the first portion and the second portion while irradiating.
20. The method of claim 15 , the method further comprising heating the peripheral frit to a temperature sufficient to cure the peripheral frit, wherein the peripheral frit is applied to at least one of the first substrate and the second substrate in form of a paste comprising a glass material and a filler material to adjust absorption characteristics of laser or infrared rays.
21. The method of claim 20 , wherein heating the peripheral frit comprises irradiating with laser or infrared rays.
22. The method of claim 20 , wherein the peripheral frit is heated to a temperature in a range from about 300° C. to about 500° C.
23. The method of claim 15 , wherein the first portion of the inner surface extends over the entire first array.