Electronic device and method of assembling an electronic device

1. A device comprising:

an electronic component;

an electrically insulating protective layer overlaying and in contact with at least a portion of the electronic component; and

injection molded material overlaying at least the portion of the electronic component and the overlaying protective layer wherein the electrically insulating protective layer is arranged to protect the electronic component during injection molding of the overlaying injection molded material.

2. The device as claimed in claim 1 wherein the electrically insulating protective layer is also thermally conductive.

3. The device as claimed in claim 1 wherein the electrically insulating protective layer comprises a ceramic resin.

4. The device as claimed in claim 1 wherein the electrically insulating protective layer is housed within a protective shield.

5. The device as claimed in claim 1 wherein the electronic component is mounted on a substrate.

6. The device as claimed in claim 5 wherein the substrate acts as a heat sink during injection molding.

7. The device as claimed in claim 5 wherein the substrate forms part of the mechanical structure of the device.

8. A method comprising:

forming an electrically insulating protective layer over at least a portion of an electronic component, wherein the electronic component is mounted on a first side of a printed circuit board, and wherein the electrically insulating protective layer overlays and is in contact with at least the portion of the electronic component and at least a portion of the first side of the printed circuit board; and

forming a molded layer over at least the portion of the electronic component and the overlaying protective layer by injection molding, wherein the molded layer is in contact with another different side of the printed circuit board.

9. The method as claimed in claim 8 wherein the electrically insulating protective layer protects the electronic component during injection molding.

10. The method as claimed in claim 8 wherein the electrically insulating protective layer is also thermally conductive.

11. The method as claimed in claim 8 wherein the electrically insulating protective layer comprises a ceramic resin.

12. The method as claimed in claim 8 wherein forming the electrically insulating protective layer comprises at least partially covering the electronic component in a viscous ceramic resin and then curing the resin.

13. The method as claimed in claim 12 wherein forming the electrically insulating protective layer comprises surrounding at least a portion of the electronic component with a frame and injecting the viscous ceramic resin into the frame.

14. The method as claimed in claim 8 comprising mounting the electronic component on a substrate before injection molding.

15. The method as claimed in claim 14 wherein the substrate acts as a heat sink during injection molding.

16. The method as claimed in claim 14 wherein the substrate forms part of the mechanical structure of the electronic device.

17. The method as claimed in claim 14 wherein the substrate is an aluminium I beam.

18. A method comprising:

mounting an electromagnetic shield to a printed circuit board;

forming an electrically insulating protective layer between the electromagnetic shield and the printed circuit board, wherein the electrically insulating protective layer is in contact with the printed circuit board and the electromagnetic shield;

attaching the printed circuit board to a substrate;

injection molding over the printed circuit board;

wherein the substrate forms part of an electronic device.

19. The method as claimed in claim 18 wherein the substrate provides mechanical support to the printed circuit board during injection molding.

20. The method as claimed in claim 18 wherein the substrate acts a heat sink during injection molding.