IP Library Granted Patent US 7,932,464
Granted Patent B2
US 7,932,464 · App. 11/649,723 · Granted Apr 26, 2011

Methods of scoring for fabricating interconnected photovoltaic cells

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Quick Facts
Patent No.
US 7,932,464
App. No.
11/649,723
Granted
Apr 26, 2011
Kind
B2
Abstract

The invention, in one embodiment, is directed to a method of scoring the coating of a first coated base material at a temperature sufficiently elevated to part the coating and melt at least a portion of the first base material. In a further embodiment, the invention is directed to a method of forming a photovoltaic module by scoring a coating of a first coated base material at a temperature sufficiently elevated to part the coating and melt at least a portion of the first base material; scoring a coating of a second coated base material at a temperature sufficiently elevated to part the coating and at least a portion of the second base material; and joining the first and second base materials to form a photovoltaic module.

Claims (29)

1. A method of scoring, comprising:

providing an article containing a coating on a first base material; and

scoring the coating at a temperature sufficiently elevated to part the coating and melt at least a portion of the first base material; and

applying a heterojunction composite material to the coating.

2. The method of claim 1 , wherein the heterojunction composite material comprises fullerenes.

3. The method of claim 2 , wherein the heterojunction composite material comprises C 60 .

4. The method of claim 2 , wherein the heterojunction composite material comprises fullerene particles.

5. The method of claim 4 , wherein the fullerene particles have an average size of between about 100 nm and about 400 nm.

6. The method of claim 1 , wherein the heterojunction composite material comprises carbon nanotubes.

7. The method of claim 1 , wherein the heterojunction composite material comprises a conjugated polymer.

8. The method of claim 7 , wherein the conjugated polymer is polythiophene, polyquinoline, or polyphenylene vinylene.

9. The method of claim 1 , further comprising applying a hole transport material to the heterojunction composite material.

10. The method of claim 9 , wherein the hole transport material comprises polythiophene or polyaniline.

11. The method of claim 9 , wherein the hole transport material comprises poly(3,4-ethylene dioxythiophene).

12. The method of claim 1 , wherein the heterojunction composite material is dispersed in a hole transport material.

13. The method of claim 1 , wherein the parting of the coating and the melting of the first base material disrupts electrical continuity of the coating.

14. The method of claim 1 , wherein the scoring step is performed using a heated stylus.

15. The method of claim 1 , wherein the scoring step is performed using a soldering iron tip.

16. The method of claim 1 , wherein the scoring step is performed mechanically.

17. The method of claim 1 , wherein the coating comprises a conductive layer.

18. The method of claim 1 , wherein the first base material comprises a polyethylene terephthalate material.

19. The method of claim 1 , wherein the first base material is significantly light transmitting.

20. The method of claim 1 , wherein the first base material is flexible.

21. The method of claim 1 , wherein the coating comprises indium tin oxide.

22. A method of scoring, comprising:

providing an article containing a coating on a first base material; and

scoring the coating at a temperature sufficiently elevated to part the coating and melt at least a portion of the first base material; and

joining the first coated base material and a second base material to form a photovoltaic module.

23. The method of claim 22 , further comprising applying a heterojunction composite material to the coating before the joining step.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2023
From: MERCK PATENT GMBH
To: ASCA
Reel/Frame 062985/0513 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2013
From: KONARKA TECHNOLOGIES, INC.
To: MERCK KGAA
Reel/Frame 029717/0048 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2013
From: MERCK KGAA
To: MERCK PATENT GMBH
Reel/Frame 029717/0065 →
SECURITY AGREEMENT Recorded Oct 26, 2011
From: KONARKA TECHNOLOGIES, INC.
To: TOTAL GAS & POWER USA (SAS)
Reel/Frame 027465/0192 →
SECURITY AGREEMENT Recorded Oct 17, 2011
From: KONARKA TECHNOLOGIES, INC.
To: MASSACHUSETTS DEVELOPMENT FINANCE AGENCY
Reel/Frame 027297/0772 →
AMENDMENT TO SECURITY AGREEMENT Recorded Oct 17, 2011
From: KONARKA TECHNOLOGIES, INC.
To: MASSACHUSETTS DEVELOPMENT FINANCE AGENCY
Reel/Frame 027468/0697 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 16, 2007
From: RYAN, JAMES
To: KONARKA TECHNOLOGIES, INC.
Reel/Frame 019032/0455 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2007
From: RYAN, JAMES
To: KONARKA TECHNOLOGIES, INC.
Reel/Frame 019026/0403 →