Multiple printed circuit board heat transfer guide plates
View Patent ↗A mechanical set of plates is able to simultaneously and quickly removably secure and remove one or more printed circuit boards (PCBs) in an enclosure in one single motion, and act as a heat sink to conduct heat away from the PCBs. The PCBs are removably secured through a clamping mechanism that may be a screw type or cam lever action by clamping down on the exposed card edges, thus allowing thermal transfer to begin on all cards. The apparatus may be used with any enclosure requiring thermal transfer from PCBs to the enclosure, including cages and enclosures that may or may not use forced airflow (fans or blowers) for heat dissipation.
1. An apparatus for securing at least one electronic module in a holder, the apparatus comprising:
a stationary guide plate including a plurality of stationary boundaries;
a movable guide plate including a plurality of movable boundaries, each movable boundary being positioned opposite a respective stationary boundary of the stationary guide plate, a plurality of channels being formed by a respective stationary and a movable boundary, the channels serving to guide at least one electronic module into position in the holder; and
a clamping mechanism configured to enable repositioning of the movable guide plate in a manner where the widths of the plurality of channels substantially simultaneously increase or decrease for removably securing an electronic module in a holder.
2. An apparatus according to claim 1 wherein the clamping mechanism is configured to enable repositioning of the movable guide plate to a position between a maximum channel width position and a minimum channel width position.
3. An apparatus according to claim 2 wherein the clamping mechanism is configured to enable positioning of the movable guide plate to a position where the plurality of stationary boundaries and the plurality of movable boundaries are pressed substantially simultaneously against a first surface and a second surface of the at least one electronic module, respectively.
4. An apparatus according to claim 3 wherein a first instance of the apparatus is placed on a bottom face of an inside of the holder and a second instance of the apparatus, in a mirror fashion to that of the first instance, is placed on a top face of the inside of the holder to removably secure bottom edges and top edges of the at least one electronic module, respectively.
5. An apparatus according to claim 4 wherein the clamping mechanism substantially simultaneously operates, in one action, both the movable plate on the first instance and the movable plate on the second instance.
6. An apparatus according to claim 5 wherein the at least one electronic module is a printed circuit board.
7. An apparatus according to claim 5 wherein the clamping mechanism, stationary guide plates and movable guide plates include materials to thermally conduct heat to the holder through contact with the at least one electronic module.
8. An apparatus according to claim 5 wherein the clamping mechanism includes a screw or cam lever.
9. An apparatus according to claim 5 wherein the holder is an enclosure formed of a material in which thermal transfer from the at least one electronic module to the holder is desired.
10. An apparatus according to claim 9 wherein the plurality of channels are arranged to guide the at least one electronic module into position in alignment with a backplane connector.
11. A method for securing at least one electronic module in a holder, the method comprising:
using a stationary guide plate providing a plurality of stationary boundaries;
using a movable guide plate providing a plurality of movable boundaries, each movable boundary being opposite a respective stationary boundary of the stationary guide plate; and
forming channels between respective pairs of movable boundaries and stationary boundaries, the channels enabling at least one electronic module to be guided into position in the holder, and widths of the channels being substantially simultaneously increasable or decreasable by positioning the movable boundaries.
12. A method according to claim 11 further comprising enabling positioning of the movable guide plate to a position between a maximum channel width position and a minimum channel width position.
13. A method according to claim 12 further comprising enabling positioning of the movable guide plate such that the plurality of stationary boundaries and the plurality of movable boundaries are pressed substantially simultaneously against a first surface and a second surface of the at least one electronic module, respectively.
14. A method according to claim 13 further comprising forming a first instance of the stationary guide plate providing a plurality of stationary first boundaries and the movable guide plate providing a plurality of movable boundaries, each movable boundary being opposite its respective stationary boundary of the stationary guide plate, on a bottom face of the inside of a holder, and forming a second instance of the stationary guide plate providing a plurality of stationary boundaries and the movable guide plate providing a plurality of movable boundaries, in a mirror fashion to that of the first instance, on a top face of the inside of the holder, to removably secure bottom edges and top edges of the at least one electronic module, respectively.
15. A method according to claim 14 further comprising enabling substantially simultaneous positioning, in one action, of both the movable plate on the first instance and the movable plate on the second instance.
16. A method according to claim 15 wherein the at least one electronic module is a printed circuit board.
17. A method according to claim 15 wherein a clamping mechanism, stationary guide plates and movable guide plates include materials to thermally conduct heat to the holder through contact with the electronic at least one electronic module.
18. A method according to claim 15 wherein the clamping mechanism includes a screw or cam lever.
19. A method according to claim 15 wherein the holder is an enclosure formed of a material in which thermal transfer from the at least one electronic module to the holder is desired.
20. A method according to claim 19 further comprising guiding the at least one electronic module into position in plurality of channels in alignment with a backplane connector.
21. A system for securing at least one electronic module in a holder, the system comprising:
stationary guide plate means for providing a plurality of stationary boundaries;
movable guide plate means for providing a plurality of movable boundaries, each movable boundary being opposite its respective stationary boundary of the stationary guide plate;
means for guiding the at least one electronic module into position in the holder in a plurality of channels formed by the pairs of stationary and movable boundary pairs; and
means for positioning the movable boundaries in a manner where widths of the plurality of channels are substantially simultaneously increased or decreased.