IP Library Granted Patent US 7,697,585
Granted Patent B2
US 7,697,585 · App. 11/651,074 · Granted Apr 13, 2010

Semiconductor laser diode

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,697,585
App. No.
11/651,074
Granted
Apr 13, 2010
Kind
B2
Abstract

A semiconductor laser diode comprising a semiconductor substrate having an active layer with a pair of cavity facets opposed to each other on both ends of active layer as well as a first dielectric film of an oxide and a second dielectric film of an oxynitride successively stacked on one cavity facet has sufficient initial characteristics with a film structure having excellent heat radiability for allowing stable high-output lasing over a long period without reducing a catastrophic optical damage level on an emission end.

Claims (14)

1. A semiconductor laser diode comprising:

a semiconductor substrate having an active layer with a pair of cavity facets opposed to each other on both ends of said active layer; and

a first dielectric film of aluminum oxynitride having a nitrogen content of 1 to 10% and a second dielectric film of aluminum oxynitride having an oxygen content of 5 to 10% successively stacked on one of said cavity facets.

2. The semiconductor laser diode according to claim 1 , wherein

the thickness of said first dielectric film is 3 to 20 nm.

3. The semiconductor laser diode according to claim 1 , wherein

the thickness of said second dielectric film is 30 to 100 nm.

4. The semiconductor laser diode according to claim 1 , further including a third dielectric film of an oxide stacked on said second dielectric film.

5. The semiconductor laser diode according to claim 4 , wherein

said third dielectric film is made of at least any material selected from aluminum oxide, silicon oxide, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, niobium oxide, aluminum oxynitride, silicon oxynitride and silicon nitride.

6. The semiconductor laser diode according to claim 4 , wherein

the thickness of said third dielectric film is at least 20 nm.

7. The semiconductor laser diode according to claim 1 , wherein

said second dielectric film is made of an oxynitride prepared from a target of aluminum oxide (Al x O y (0<x<1, 0<y<0.6)) in an ECR sputtering apparatus.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 10, 2022
From: SHARP KABUSHIKI KAISHA
To: SHARP FUKUYAMA LASER CO., LTD.
Reel/Frame 059039/0927 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 9, 2007
From: SOGABE, RYUICHI; KAWAGUCHI, YOSHINOBU; KAMIKAWA, TAKESHI
To: SHARP KABUSHIKI KAISHA
Reel/Frame 018780/0545 →