Image sensor module having precise image-projection control
An image sensor module comprises an image sensor chip, at least one lens layer, and at least one bonding layer. The image sensor chip has an image capturing zone manufactured with an image capturing element, and a partition zone surrounding the image capturing zone. The at least one lens layer is stacked on the image sensor chip, having a transparent substrate and a lens mounted on the transparent substrate and adapted to focus the projected image onto the image capturing zone of the image sensor chip. The at least one bonding layer is arranged corresponding to the partition zone of the image sensor chip and bonded between the image sensor chip and the at least one lens layer, mixing of a glue agent and a plurality of spacer elements with which the height of each the spacer elements is determined to be the height of the bonding layer.
1. An image sensor module comprising
an image sensor chip, said image sensor chip having an image capturing zone and a partition zone surrounding said image capturing zone;
at least one lens layer stacked on said image sensor chip, said lens layer having a transparent substrate and a lens mounted on said transparent substrate and adapted to project the image of an object onto said image capturing zone of said image sensor chip; and
only one bonding layer arranged corresponding to said partition zone of said image sensor chip, said bonding layer comprising a glue agent and a plurality of spacer elements mixed in said glue agent, the height of said spacer elements being the height of the respective bonding layer, said only one bonding layer bonded between said image sensor chip and said at least one lens layer.
2. The image sensor module as claimed in claim 1 , wherein said lens layer is deposed of a spacer layer made of a glass material having a predetermined thickness and corresponded to said partition zone of said image sensor chip.
3. The image sensor module as claimed in claim 2 , wherein said spacer layer is bonded to the transparent substrate of said lens layer with said one bonding layer.
4. The image sensor module as claimed in claim 2 , wherein said spacer layer is sandwiched between said image sensor chip and said at least one lens layer, having two opposite sides respectively bonded to said image sensor chip and to said at least one lens layer by said bonding layer.
5. The image sensor module as claimed in claim 1 , further comprising an optical micro lens array arranged on said image sensor chip and working with said lens layer to focus the projected image of an object onto the image capturing zone of said image sensor chip.
6. The image sensor module as claimed in claim 5 , further comprising a transparent panel arranged on said micro lens array, said transparent panel having two opposite sides respectively bonded to said image sensor chip and said at least one lens layer by said bonding layer.
7. The image sensor module as claimed in claim 1 , wherein said at least one lens layer includes multiple lens layers stacked on said image sensor chip and bonded to one another by said bonding layer.
8. The image sensor module as claimed in claim 7 , wherein the transparent substrates of each two adjacent lens layers of said multiple lens layers are bonded together by said bonding layer.
9. The image sensor module as claimed in claim 1 , wherein the volume density of mixing the spacer elements and the glue agent of said bonding layer is at the respective ratio of within 1:10˜1:100.
10. The image sensor module as claimed in claim 1 , wherein the spacer elements of said bonding layer are spherical beads arranged in such a manner that the contact interface of each of said spacer elements with said image sensor chip and said at least one lens layer is respective a point-to-point contact.
11. The image sensor module as claimed in claim 1 , wherein the spacer elements of said bonding layer are cylindrical glass-fiber members arranged in such a manner that the contact interface of each of said spacer elements with said image sensor chip and said at least one lens layer is respective a line-to-line contact.
12. The image sensor module as claimed in claim 1 , wherein said spacer elements are selected from one of the materials of SiO 2 , SiC, and polystyrene.
13. The image sensor module as claimed in claim 1 , wherein said image sensor chip is manufactured by a SSIS (Solid State Image Sensor) technology of integrated circuit manufacturing.
14. An image sensor module comprising
an image sensor chip, said image sensor chip having an image capturing zone and a partition zone surrounding said image capturing zone;
a plurality of lens layers stacked on said image sensor chip, each of said lens layers having a transparent substrate and a lens mounted on said transparent substrate and adapted to project the image of an object onto said image capturing zone of said image sensor chip; and
only one bonding layer arranged corresponding to said partition zone of said image sensor chip, said only one bonding layer comprising a glue agent and a plurality of spacer elements mixed in said glue agent, the height of said spacer elements being the height of the respective bonding layer, two of said lens layers bonded to each other by said only one bonding layer.
15. The image sensor module as claimed in claim 14 , wherein said lens layer is deposed of a spacer layer made of a glass material having a predetermined thickness and corresponded to said partition zone of said image sensor chip.
16. The image sensor module as claimed in claim 15 , wherein one of said spacer layers is bonded to the respective transparent substrate of said lens layer with said bonding layer.
17. The image sensor module as claimed in claim 15 , wherein one of said spacer layers is sandwiched between said image sensor chip and the respective lens layer, having two opposite sides respectively bonded to said image sensor chip and to said lens layer by said bonding layer.
18. The image sensor module as claimed in claim 14 , further comprising an optical micro lens array arranged on said image sensor chip and working with said lens layers to focus the projected image of an object onto the image capturing zone of said image sensor chip.
19. The image sensor module as claimed in claim 18 , further comprising a transparent panel arranged on said micro lens array, said transparent panel having two opposite sides respectively bonded to said image sensor chip and to one of said lens layers by said bonding layer.
20. The image sensor module as claimed in claim 14 , wherein said image sensor chip bonded with one of said lens layers by said bonding layer.
21. The image sensor module as claimed in claim 20 , wherein the transparent substrates of each two adjacent lens layers of said lens layers are bonded together by said bonding layer.
22. The image sensor module as claimed in claim 14 , wherein the volume density of mixing the spacer elements and the glue agent of said bonding layer is at the respective ratio of within 1:10˜1:100.
23. The image sensor module as claimed in claim 14 , wherein the spacer elements of said bonding layer are spherical beads arranged in such a manner that the contact interface of each of said spacer elements with said lens layer is respective a point-to-point contact.
24. The image sensor module as claimed in claim 14 , wherein the spacer elements of said bonding layer are cylindrical glass-fiber members arranged in such a manner that the contact interface of each of said spacer elements with said lens layer is respective a line-to-line contact.
25. The image sensor module as claimed in claim 14 , wherein said spacer elements are selected from one of the materials of SiO 2 , SiC, and polystyrene.
26. The image sensor module as claimed in claim 14 , wherein said image sensor chip is manufactured by a SSIS (Solid State Image Sensor) technology of integrated circuit manufacturing.