Nozzle arrangement with an ink ejecting displaceable roof structure
View Patent ↗A nozzle arrangement is provided for an inkjet printhead. The nozzle arrangement includes a wafer substrate assembly defining an ink inlet channel and a first wall surrounding the ink inlet channel. A thermal actuator includes an anchor extending from the wafer substrate assembly outside of the confines of the first wall, and thermal actuator arms extending from the anchor. A roof structure is operatively mounted to terminate the actuator arms and covers the first wall. The roof structure defines a second wall surrounding the first wall so that the wafer substrate assembly and the roof structure together define a nozzle chamber in which ink from the ink inlet channel can be supplied. The roof structure further defines a rim through which ink in the nozzle chamber can be ejected. Upon thermal actuation of the actuator, the actuator moves the roof structure with respect to the wafer substrate assembly to thereby eject ink in the nozzle chamber through the rim.
1. A nozzle arrangement for an inkjet printhead, the nozzle arrangement comprising:
a wafer substrate assembly defining an ink inlet channel and a first wall surrounding the ink inlet channel;
a thermal actuator comprising an anchor extending from the wafer substrate assembly outside of the confines of the first wall, and thermal actuator arms extending from the anchor; and
a roof structure operatively mounted to terminate the actuator arms and which covers the first wall, the roof structure defining a second wall surrounding the first wall so that the wafer substrate assembly and the roof structure together define a nozzle chamber in which ink from the ink inlet channel can be supplied, the roof structure further defining a rim through which ink in the nozzle chamber can be ejected so that, upon thermal actuation of the actuator, the actuator moves the roof structure with respect to the wafer substrate assembly to eject ink in the nozzle chamber through the rim.
2. A nozzle arrangement as claimed in claim 1 , wherein the roof structure comprises a planar roof member from which the second wall depends, the roof member defining the rim and being arranged so that the rim is out of alignment with the ink inlet channel.
3. A nozzle arrangement as claimed in claim 1 , wherein the anchor comprises a pair of spaced active anchor portions and a pair of spaced passive anchor portions.
4. A nozzle arrangement as claimed in claim 3 , wherein the thermal actuator arms comprise a pair of active actuator arms connected to the active anchor portions and a pair of passive actuator arms connected to the passive anchor portions.
5. A nozzle arrangement as claimed in claim 3 , wherein the wafer substrate assembly comprises a silicon wafer substrate and CMOS micro-processing circuitry positioned on the silicon wafer substrate and electrically coupled to the pair of spaced active anchor portions.
6. A nozzle arrangement as claimed in claim 1 , wherein the wafer substrate assembly comprises a silicon dioxide layer positioned on a wafer substrate.
7. A nozzle arrangement as claimed in claim 6 , wherein the wafer substrate assembly further comprises an ink passivation layer in the form of a layer of silicon nitride on the silicon dioxide layer.
8. A printhead comprising a two dimensional array of nozzle arrangements as claimed in claim 1 .