Fluid cooled encapsulated microelectronic package
View Patent ↗An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.
1. A microelectronic package, comprising:
a first semiconductor chip;
a fluid-carrying cooling tube disposed in proximity to a first surface of said first semiconductor chip;
a thermally conductive bonding material disposed between said cooling tube and the first surface of said first semiconductor chip, thermally bonding said cooling tube to said first surface; and
a plastic encapsulant molded over said first semiconductor chip and portions of said cooling tube in proximity to said chip,
wherein said first surface of said first semiconductor chip is an active surface, and said microelectronic package further comprises a shunt element disposed adjacent said semiconductor chip and electrically coupled to said cooling tube to form an electrical circuit including said first surface, said cooling tube and said shunt element, and
a conductor-clad electrically insulating thermally conductive wafer that electrically isolates said cooling tube from said first semiconductor chip and shunt element, said wafer having a first surface thermally bonded to said cooling tube and a second surface thermally bonded to said first semiconductor chin and said shunt element.