MEMS device with integrated optical element

1. A spatial light modulator comprising:

a substrate;

an optical element over the substrate, wherein the optical element is an etalon;

a buffer layer over the optical element; and

a light modulating element over the buffer layer, wherein the light modulating element comprises an optical cavity and a support, wherein the support is entirely over and directly aligned with the optical element;

wherein the height of the support corresponds approximately to the height of the cavity; and

wherein the optical element is separated from the support by the buffer layer.

2. An electromechanical systems device comprising:

a substrate;

an etalon over the substrate;

at least one buffer layer over the etalon; and

a light modulating element on the buffer layer, wherein the light modulating element comprises an optical cavity and a support, wherein the support is entirely over and aligned with the underlying etalon;

wherein the height of the support corresponds approximately to the height of the cavity; and

wherein the etalon is electrically insulated from the light modulating element.

3. The electromechanical systems device of claim 2 , wherein the etalon comprises a first reflective layer, a second reflective layer, and a dielectric layer sandwiched between the first and the second reflective layers.

4. The electromechanical systems device of claim 3 , wherein the second reflective layer is fully reflective.

5. The electromechanical systems device of claim 3 , wherein the first and the second reflective layers each comprises a metal.

6. The electromechanical systems device of claim 2 , wherein the buffer layer comprises a dielectric material.

7. The electromechanical systems device of claim 2 further comprising a conductive layer on top of the buffer layer.

8. The electromechanical systems device of claim 2 , wherein the light modulating element comprises an interferometric modulator.

9. The electromechanical systems device of claim 8 , wherein the interferometric modulator comprises an optical stack, a movable layer, and the optical cavity separating the optical stack from the movable layer.

10. The electromechanical systems device of claim 2 , wherein the support contacts the buffer layer in an area that is about the same size as the cross-sectional area of the etalon.

11. The electromechanical systems device of claim 2 , wherein the support comprises a post.

12. A method of making an electromechanical systems device, comprising:

providing a substrate;

fabricating an etalon on the substrate;

forming at least one buffer layer over the etalon;

forming a support on the buffer layer, wherein the support is entirely over and aligned with the underlying etalon;

forming a first reflective layer on the buffer layer;

forming a second reflective layer over the first reflective layer; and

forming a cavity between the first reflective layer and the second reflective layer, wherein the second reflective layer is supported over the first reflective layer by the support;

wherein the height of the support corresponds approximately to the height of the cavity.

13. The method of claim 12 , wherein fabricating the etalon comprises:

forming a sandwich stack over a portion of the substrate, wherein the sandwich stack comprises a first reflective layer, a second reflective layer, and a dielectric layer between the first and second reflective layers; and

removing a portion of the sandwich stack.

14. The method of claim 12 , wherein fabricating the etalon comprises:

depositing a first reflective layer on at least a portion of the substrate;

removing a portion of the first reflective layer to form a recess;

depositing a dielectric layer over the first reflective layer and over the recess;

depositing a second reflective layer over the dielectric layer; and

removing at least a portion of the second reflective layer from over the recess.

15. The method of claim 12 , wherein forming at least one buffer layer comprises:

depositing a dielectric layer on the etalon;

forming a planarization layer on the dielectric layer; and

removing the planarization layer and a part of the dielectric layer.

16. The method of claim 15 , wherein removing the planarization layer and the part of the dielectric layer comprises etching to form a substantially flat buffer layer.

17. An electromechanical systems device made by the method of claim 12 .

18. An electromechanical systems device comprising:

a means for transmitting or reflecting light;

a means for modulating light transmitted through or reflected from the transmitting or reflecting means;

a means for supporting at least a portion of the light modulating means over the transmitting or reflecting means;

a means for absorbing at least a portion of the light transmitted through or reflected from the transmitting or reflecting means; and

a means for separating the light absorbing means from the supporting means.

19. The electromechanical systems device of claim 18 , wherein the transmitting or reflecting means comprises a substrate.

20. The electromechanical systems device of claim 18 , wherein the light modulating means comprises an interferometric modulator.

21. The electromechanical systems device of claim 18 , wherein the supporting means comprises a post.

22. The electromechanical systems device of claim 18 , wherein the light absorbing means comprises an etalon.

23. The electromechanical systems device of claim 18 , wherein the separating means comprises one or more dielectric layers.

24. An electromechanical systems display device comprising:

a substrate;

a plurality of etalons on the substrate;

at least one buffer layer over the plurality of etalons; and

an array of interferometric modulators on said buffer layer, wherein said array comprises optical cavities and a plurality of supports configured to align with the plurality of etalons;

wherein the height of the plurality of supports corresponds approximately to the height of the plurality of cavities; and

wherein the plurality of etalons are electrically insulated from the array of interferometric modulators by the buffer layer.

25. The electromechanical systems display device of claim 24 , comprising:

a processor that is configured to communicate with the array, the processor being configured to process image data; and

a memory device configured to communicate with the processor.

26. The electromechanical systems display device of claim 25 , further comprising a driver circuit configured to send at least one signal to the array.

27. The electromechanical systems display device of claim 26 , further comprising a controller configured to send at least a portion of the image data to the driver circuit.

28. The electromechanical systems display device of claim 25 , further comprising an image source module configured to send the image data to the processor.

29. The electromechanical systems display device of claim 28 , wherein the image source module comprises at least one of a receiver, transceiver, and transmitter.

30. The electromechanical systems display device of claim 25 , further comprising an input device configured to receive input data and to communicate the input data to the processor.

31. The electromechanical systems device of claim 2 , wherein the etalon is configured to absorb substantially all visible light.