Production of flat dielectric barrier discharge lamps
The invention relates to the production of dielectric barrier discharge lamps with a flat discharge vessel. At least one material recess ( 5 ), for example a groove, is provided in at least one discharge vessel part ( 1 ). During the joining of the discharge vessels in a vacuum oven, at least pressure equalization or else evacuation, purging and filling steps can be carried out through the material recess or recesses. This makes it possible to avoid stresses and, in particular when a plurality of discharge vessels which are stacked one on top of the other are being joined, to achieve standard gas purity in the completely joined discharge vessels. The material recesses ( 5 ) are closed by glass solder ( 8 ) once the lamp has been completely joined together.
1 . A method for production of a dielectric barrier discharge lamp having a flat discharge vessel, in which a cover plate and a base plate are optionally connected to an additional frame arranged in between them,
and these discharge vessel parts are connected by melting of glass solder,
whereby
at least one discharge vessel part has at least one material recess before the connection of all of the discharge vessel parts,
the material recess remains during the connection process as access to the interior of the discharge vessel,
and, after the connection process, glass solder runs into the material recess, by heating the discharge vessel in an oven, and closes this material recess and thus the discharge vessel.
2 . The method as claimed in claim 1 , with the material recess being in the form of a groove.
3 . The method as claimed in claim 2 , with the groove having an essentially V-shaped profile.
4 . The method as claimed in claim 2 , with the groove being formed by deep drawing in the base plate or cover plate.
5 . The method as claimed in claim 1 , with two material recesses being arranged diagonally in the corner areas of a discharge vessel part.
6 . The method as claimed in claim 1 , with one material recess in each case being arranged in each of the four corner areas of a discharge vessel part.
7 . The method as claimed in claim 1 , in which, before the connection of the discharge vessel parts, glass solder is arranged at a point which will be positioned at least in the vicinity of the material recess after the connection process.
8 . The method as claimed in claim 1 , in which, before the connection of the discharge vessel parts, glass solder is applied in the connection area.
9 . The method as claimed in claim 1 , in which the discharge vessel parts are joined together and the discharge vessel is subsequently heated in a joining chamber which surrounds the base plate and the cover plate, fitting them.
10 . The method as claimed in claim 1 , in which there is no further significant temperature increase after the material recess or recesses has or have been closed.
11 . The method as claimed in claim 9 , with the discharge vessel parts for two or more discharge vessels being joined together successively and being stacked one on top of the other in the joining chamber.
12 . A dielectric barrier discharge line having a flat discharge vessel, produced using a method as claimed in claim 1 , which has at least one base plate and one cover plate with at least one material recess in at least one of the discharge vessel parts being closed by glass solder which is melted and solidified again.
13 . The method as claimed in claim 2 , with two material recesses being arranged diagonally in the corner areas of a discharge vessel part.
14 . The method as claimed in claim 2 , with one material recess in each case being arranged in each of the four corner areas of a discharge vessel part.
15 . The method as claimed in claim 2 , in which, before the connection of the discharge vessel parts, glass solder is arranged at a point which will be positioned at least in the vicinity of the material recess after the connection process.
16 . The method as claimed in claim 2 , in which, before the connection of the discharge vessel parts, glass solder is applied in the connection area.
17 . The method as claimed in claim 10 , with the discharge vessel parts for two or more discharge vessels being joined together successively and being stacked one on top of the other in the joining chamber.