Tools for polishing and associated methods
View Patent ↗Polishing tools and associated methods are disclosed. In one aspect, a method of polishing a work piece is provided. Such a method may include providing a polishing tool having asperities on a working surface, where the asperities have a tip-to-tip RA value of less than or equal to about 10 μm, and the working surface has a surface roughness RA value of less than or equal to about 50 μm. The method may further include contacting the tips of the asperities against an interface surface of the work piece and moving the tips of the asperities in a direction substantially parallel to the interface surface of the work piece such that the interface surface is polished.
1. A method of polishing a work piece, comprising:
providing a polishing tool comprised of at least about 50% metal, said polishing tool having asperities on a working surface, said asperities having a tip-to-tip RA value of less than or equal to about 10 μm, and said working surface having a surface roughness RA value of less than or equal to about 50 μm;
contacting the tips of the asperities against an interface surface of the work piece; and
moving the tips of the asperities in a direction substantially parallel to the interface surface of the work piece such that the interface surface is polished.
2. The method of claim 1 , wherein the tip-to-tip RA value is less than or equal to about 5 μm.
3. The method of claim 1 , wherein the tip-to-tip RA value is less than or equal to about 1 μm.
4. The method of claim 1 , wherein the tip-to-tip RA value is less than or equal to about 0.8 μm.
5. The method of claim 1 , wherein nano-abrasive particles are disposed within at least a portion of the working surface of the polishing tool.
6. The method of claim 5 , wherein the nano-abrasive particles include a member selected from the group consisting of diamond, boron carbide, cubic boron nitride, garnet, silica, ceria, alumina, zircon, zirconia, titania, manganese oxide, copper oxide, iron oxide, nickel oxide, silicon carbide, silicon nitride, tin oxide, titanium carbide, titanium nitride, tungsten carbide, yttria, and mixtures thereof.
7. The method of claim 6 , wherein the nano-abrasive particles include diamond.
8. The method of claim 6 , wherein the nano-abrasive particles include cubic boron nitride.
9. The method of claim 1 , wherein the polishing tool is comprised of at least about 75% metal.
10. The method of claim 1 , wherein the polishing tool is comprised of at least about 95% metal.
11. The method of claim 1 , wherein an electrical bias is introduced into the polishing tool to electrolytically enhance polishing.
12. The method of claim 1 , wherein the work piece is polished in the absence of abrasive particles.
13. The method of claim 1 , further comprising applying a slurry having nano-abrasive particles to the working surface.
14. The method of claim 1 , wherein the work piece is a member selected from the group consisting of wafers, interconnect circuitry, silicon, glass, gallium arsenide, gallium nitride, aluminum nitride, sapphire, quartz, lithium niobate, lithium tantanate, PZT, semiconductors, piezoelectric materials, surface acoustic wave filter materials, or combinations thereof.