IP Library Granted Patent US 8,355,069
Granted Patent B2
US 8,355,069 · App. 11/657,783 · Granted Jan 15, 2013

Solid-state image pickup device

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Quick Facts
Patent No.
US 8,355,069
App. No.
11/657,783
Granted
Jan 15, 2013
Kind
B2
Abstract

A solid-state image pickup device includes pixels diagonally arranged, each including a photoelectric conversion unit and a plurality of transistors and wiring extending in the vertical and horizontal directions which is diagonally arranged around the photoelectric conversion unit in each of the pixels so that at least one portion of the wiring is arranged along at least one side of the photoelectric conversion unit.

Claims (11)

1. A solid-state image pickup device comprising:

a plurality of pixels each including a photoelectric conversion unit having a plurality of transistors, the plurality of pixels being diagonally arranged;

wiring extending in vertical and horizontal directions, the wiring being diagonally arranged, and further wherein a vertical signal line and well contact line extend in the vertical direction, at least one of the vertical signal line and well contact line having linear diagonal portions formed immediately adjacent corresponding boundary portions of the photoelectric conversion unit without any signal line or electronic component therebetween, such that the well contact line and vertical signal line are formed at opposite sides of each pixel and each of the vertical signal line and well contact line has portions immediately adjacent boundary portions of the photoelectric conversion unit and there being two sets of well contact lines and vertical signal lines in a common level located between horizontally adjacent pixels and only a single vertical signal line and a single well contact line located in the common level in region between two diagonally adjacent pixels; and

wherein for each of the plurality of pixels, at least one among the plurality of transistors is shared by two or more photoelectric conversion units which are diagonally arranged.

2. The solid-state image pickup device of claim 1 ,

wherein the diagonally arranged portion of the wiring is linearly formed.

3. The solid-state image pickup device of claim 1 ,

wherein the diagonally arranged portion of the wiring is formed in a zigzag manner.

4. The solid-state image pickup device of any one of claim 1 ,

wherein the vertical signal line is for reading out a signal.

5. The solid state image pickup device of claim 1 , wherein each of the plurality of photoelectric conversion units has first boundary portions with the vertical signal line immediately adjacent the first boundary portions and second boundary portions with the well contact line immediately adjacent the second boundary portions.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 040419/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 2, 2007
From: MARUYAMA, SHUNSUKE; FUJIMAGARI, JUNICHIRO; WAKANO, TOSHIFUMI; TORII, MOTONOBU; HOSHI, HIRONORI; KIKUCHI, KOJI
To: SONY CORPORATION
Reel/Frame 019103/0871 →