Adhesive film and use thereof
View Patent ↗Disclosed in an adhesive film which enables to obtain a flexible metal clad laminate which is suppressed in dimensional change when produced by heat roll lamination. Such an adhesive film comprises a heat-resistant layer containing a highly heat resistant polyimide and an adhesive layer which is formed on at least one surface of the heat-resistant layer and contains a thermoplastic polyimide. In this adhesive film, the thermal shrinkage ratio in the TD direction is not less than +0.01%, and the thermal shrinkage ratio in the MD direction is not more than −0.02%. Consequently, when a metal layer and the adhesive film are bonded together by heat roll lamination and the resulting laminate is subjected to a treatment with heating, occurrence of dimensional changes can be sufficiently suppressed.
1. An adhesive film comprising:
a heat resistant layer containing a non-thermoplastic polyimide; and
an adhesive layer on at least one surface of the heat resistant layer, the adhesive layer containing a thermoplastic polyimide,
wherein a thermal shrinkage ratio in a TD direction is +0.01% or more,
wherein a thermal shrinkage ratio in an MD direction is −0.02% or less,
wherein tensile elastic moduli in the TD direction and MD direction are within a range of 5.0 to 11 GPa, and
wherein the thermal shrinkage ratio is calculated by subjecting the adhesive film to a heat shrinkage measurement process comprising:
storing the adhesive film at 23° C. and 55% relative humidity for 2 days,
measuring the adhesive film in a film dimension L1 ,
heating the adhesive film to 250° C. for 30 minutes,
storing the adhesive film at 25° C. and 60% relative humidity for 2 days,
measuring the adhesive film in a film dimension L2,
calculating the thermal shrinkage ratio in the TD direction, and
calculating the thermal shrinkage ratio in the MD direction.
2. The adhesive film as set forth in claim 1 , wherein the heat resistant layer and the adhesive layer on the at least one surface of the heat resistant layer are formed by a coextrusion-flow casting method.
3. The adhesive film as set forth in claim 1 , wherein the heat resistant layer and the adhesive layer on the at least one surface of the heat resistant layer are formed by a gel applying method.
4. The adhesive film as set forth in claim 1 , wherein the thermal shrinkage ratio in the TD direction is +0.03% or more, and the thermal shrinkage ratio in the MD direction is −0.05% or less.
5. The adhesive film as set forth in claim 1 , wherein the adhesive layer is formed on each side of the heat resistant layer.
6. The adhesive film as set forth in claim 1 , wherein the heat resistant layer contains a non-thermoplastic polyimide resin by 90 wt. % or more.
7. A laminate comprising an adhesive film comprising:
a heat resistant layer containing a non-thermoplastic polyimide; and
an adhesive layer on at least one surface of the heat resistant layer, the adhesive layer containing a thermoplastic polyimide,
wherein a thermal shrinkage ratio in a TD direction is +0.01% or more,
wherein a thermal shrinkage ratio in an MD direction is −0.02% or less,
wherein tensile elastic moduli in the TD direction and MD direction are within a range of 5.0 to 11 GPa, and
wherein the thermal shrinkage ratio is calculated by subjecting the adhesive film to a heat shrinkage measurement process comprising:
storing the adhesive film at 23° C. and 55% relative humidity for 2 days,
measuring the adhesive film in a film dimension L1,
heating the adhesive film to 250° C. for 30 minutes,
storing the adhesive film at 25° C. and 60% relative humidity for 2 days,
measuring the adhesive film in a film dimension L2,
calculating the thermal shrinkage ratio in the TD direction, and
calculating the thermal shrinkage ratio in the MD direction.
8. The laminate as set forth in claim 7 comprising a metal layer on the adhesive film.
9. A flexible wiring board comprising an adhesive film or a laminate comprising the adhesive film, the adhesive film comprising:
a heat resistant layer containing a non-thermoplastic polyimide; and
an adhesive layer on at least one surface of the heat resistant layer, the adhesive layer containing a thermoplastic polyimide,
wherein a thermal shrinkage ratio in a TD direction is +0.01% or more,
wherein a thermal shrinkage ratio in an MD direction is −0.02% or less
wherein tensile elastic moduli in the TD direction and MD direction are within a range of 5.0 to 11 GPa, and
wherein the thermal shrinkage ratio is calculated by subjecting the adhesive film to a heat shrinkage measurement process comprising:
storing the adhesive film at 23° C. and 55% relative humidity for 2 days,
measuring the adhesive film in a film dimension L1,
heating the adhesive film to 250° C. for 30 minutes,
storing the adhesive film at 25° C. and 60% relative humidity for 2 days,
measuring the adhesive film in a film dimension L2,
calculating the thermal shrinkage ratio in the TD direction, and
calculating the thermal shrinkage ratio in the MD direction.
10. A method for producing an adhesive film comprising:
concurrently supplying, into an extruder having a die for extruding in two or more layers, an organic solvent solution containing a polyamide acid that is a precursor of a non-thermoplastic polyimide, and either an organic solvent solution containing a thermoplastic polyimide, or an organic solvent solution containing a polyamide acid that is a precursor of the thermoplastic polyimide, and extruding the organic solvent solutions via an outlet of the die to form a film having at least two layers;
continuously supplying the extruded organic solvent solutions on a smooth-surfaced supporter, and volatilizing off at least part of an organic solvent or organic solvents from the film on the supporter in order to obtain a laminate film that is self-supportive; and
holding both edges of the laminate film in a TD direction and subjecting the laminate film to imidation while elongating the laminate film in the TD direction to an elongation ratio of greater than 1.0,
wherein the adhesive film comprises:
a heat resistant layer containing a non-thermoplastic polyimide, and
an adhesive layer on at least one surface of the heat resistant layer, the adhesive layer containing a thermoplastic polyimide,
wherein a thermal shrinkage ratio in the TD direction is +0.01% or more,
wherein a thermal shrinkage ratio in an MD direction is −0.02% or less,
wherein the heat resistant layer and the adhesive layer on the at least one surface of the heat resistant layer are formed by a coextrusion-flow casting method, and
wherein the thermal shrinkage ratio is calculated by subjecting the adhesive film to a heat shrinkage measurement process comprising:
storing the adhesive film at 23° C. and 55% relative humidity for 2 days,
measuring the adhesive film in a film dimension L1,
heating the adhesive film to 250° C. for 30 minutes,
storing the adhesive film at 25° C. and 60% relative humidity for 2 days,
measuring the adhesive film in a film dimension L2,
calculating the thermal shrinkage ratio in the TD direction, and
calculating the thermal shrinkage ratio in the MD direction.
11. A method for producing an adhesive film comprising:
forming a gel film by shaping, into a film-like shape, an organic solvent solution containing a polyamide acid, which is a precursor of a non-thermoplastic polyimide;
applying on at least one surface of the gel film an organic solvent solution containing a thermoplastic polyimide or an organic solvent solution containing a polyamide acid that is a precursor of the thermoplastic polyimide, and heating the gel film on which the organic solvent solution is applied; and
holding both edges of the laminate film in a TD direction and subjecting the laminate film to imidation while elongating the laminate film in the TD direction to an elongation ratio of greater than 1.0,
wherein the adhesive film comprises:
a heat resistant layer containing the non-thermoplastic polyimide, and
an adhesive layer on at least one surface of the heat resistant layer, the adhesive layer containing a thermoplastic polyimide,
wherein a thermal shrinkage ratio in the TD direction is +0.01% or more,
wherein a thermal shrinkage ratio in an MD direction is −0.02% or less,
wherein the heat resistant layer and the adhesive layer on the at least one surface of the heat resistant layer are formed by a gel applying method, and
wherein the thermal shrinkage ratio is calculated by subjecting the adhesive film to a heat shrinkage measurement process comprising:
storing the adhesive film at 23° C. and 55% relative humidity for 2 days,
measuring the adhesive film in a film dimension L1,
heating the adhesive film to 250° C. for 30 minutes,
storing the adhesive film at 25° C. and 60% relative humidity for 2 days,
measuring the adhesive film in a film dimension L2,
calculating the thermal shrinkage ratio in the TD direction, and
calculating the thermal shrinkage ratio in the MD direction.
12. A method for producing a flexible wiring board including an adhesive film or a laminate comprising the adhesive film, the method comprising:
providing a metal foil on the adhesive film by a heat roll laminating method,
wherein the adhesive film comprises:
a heat resistant layer containing a non-thermoplastic polyimide, and
an adhesive layer on at least one surface of the heat resistant layer, the adhesive layer containing a thermoplastic polyimide,
wherein a thermal shrinkage ratio in a TD direction is +0.01% or more,
wherein a thermal shrinkage ratio in an MD direction is −0.02% or less, and
wherein the thermal shrinkage ratio is calculated by subjecting the adhesive film to a heat shrinkage measurement process comprising:
storing the adhesive film at 23° C. and 55% relative humidity for 2 days,
measuring the adhesive film in a film dimension L1,
heating the adhesive film to 250° C. for 30 minutes,
storing the adhesive film at 25° C. and 60% relative humidity for 2 days,
measuring the adhesive film in a film dimension L2,
calculating a thermal shrinkage ratio in the TD direction, and
calculating a thermal shrinkage ratio in the MD direction.