Annular disc of bent sheet material
View Patent ↗The invention relates to an annular disc of bent sheet material ( 21 ) with at least one junction at which the annulus is closed. Furthermore, a method for producing an annular disc is disclosed, comprising the steps of: (a) providing a sheet material; (b) bending the sheet material into an annular disc; (c) severing the sheet material, so that an annular disc with a junction at which the annulus is open is provided; (d) closing the junction, so that an annular disc with a junction at which the annulus is closed is provided. A description is given of a method for producing an annular disc comprising the steps of: (i) providing a sheet material; (ii) bending the sheet material into a first part of an annular disc; (iii) severing the sheet material, so that a first part of an annular disc is provided; (iv) repeating steps (i), (ii) and (iii) at least once, so that at least one further part of the annular disc is provided; and (v) connecting the first part and the further parts of the annular disc, so that an annular disc with at least two junctions at which the annulus is closed is provided.
1. An annular disc formed by bending a sheet material, wherein the annular disc has at least one junction at which an annulus is closed, wherein the sheet material is a hard solder material being selected from silver-copper-based hard solder alloys and silver-copper-palladium-based hard solder alloys and wherein the at least one junction is connected by soldering or welding, and said annular disc has a plurality of bulges disposed transversely to a web width of the annular disc.
2. The annular disc according to claim 1 , the annular disc having two junctions at which the annulus is closed.
3. The annular disc according to claim 1 , wherein the sheet material has a Vickers hardness of up to HV1 170.
4. The annular disc according to claim 2 , wherein the sheet material has a Vickers hardness of up to HV1 170.
5. The annular disc according to claim 1 , wherein the hard solder material is selected from Ag 72 Cu 28 , Ag 69.7 Cu 28 Ge 2 Co 0.3 , Ag 68.4 Cu 26.6 Pd 5 , Ag 65 Cu 20 Pd 15 and Ag 54 Cu 21 Pd 25 .
6. The annular disc according to claim 2 , wherein the hard solder material is selected from Ag 72 Cu 28 , Ag 69.7 Cu 28 Ge 2 Co 0.3 , Ag 68.4 Cu 26.6 Pd 5 , Ag 65 Cu 20 Pd 15 and Ag 54 Cu 21 Pd 25 .
7. The annular disc according to claim 3 , wherein the hard solder material is selected from Ag 72 Cu 28 , Ag 69.7 Cu 28 Ge 2 Co 0.3 , Ag 68.4 Cu 26.6 Pd 5 , Ag 65 Cu 20 Pd 15 and Ag 54 Cu 21 Pd 25 .
8. A method for producing a soldered connection, the method comprising providing an annular disc according to claim 1 , and soldering the annular disc to a connection to provide a high vacuum seal.
9. A method according to claim 8 , wherein the soldered connection is used in a vacuum interrupter.
10. A method for producing a soldered connection, the method comprising providing an annular disc according to claim 2 and soldering the annular disc to a connection to provide a high vacuum seal.
11. A method for producing a soldered connection, the method comprising providing an annular disc according to claim 3 and soldering the annular disc to a connection to provide a high vacuum seal.
12. A method for producing a soldered connection, the method comprising providing an annular disc according to claim 4 and soldering the annular disc to a connection to provide a high vacuum seal.
13. A method for producing a soldered connection, the method comprising providing an annular disc according to claim 5 and soldering the annular disc to a connection to provide a high vacuum seal.