Method for making a radio frequency coupling structure
View Patent ↗Method for making a coupling structure ( 10 ) comprises the steps of forming a body ( 12 B) of a polymeric material loaded with a conductive filler, providing a coupling area ( 12 C) of a predetermined shape on a portion of the surface of the body ( 12 S), and attaching a conductive pad (IOP) having a shape corresponding to the shape of the coupling area ( 12 C) in non-penetrating contact with the body ( 12 B).
1. A method for making a coupling structure comprising the steps of:
a) forming a body of a polymeric material loaded with a conductive filler, the body having a surface;
b) providing a coupling area of a predetermined shape on a portion of the surface; and
c) attaching a conductive pad having a shape corresponding to the shape of the coupling area in non-penetrating contact with the body, the attaching step including the use of a resilient biasing member to urge the conductive pad against the coupling area.
2. The method of claim 1 wherein the attaching step c) comprises the step of:
adhering the conductive pad to the coupling area.
3. The method of claim 2 wherein the adhering step is performed using an adhesive.
4. The method of claim 3 wherein the adhesive is a dielectric material.
5. The method of claim 3 wherein the adhesive includes a conductive material.
6. The method of claim 1 wherein the attaching step c) comprises the step of:
forming a metallization layer over the coupling area.