Process for production of polyimide film having high adhesiveness
View Patent ↗A process for the production of non-thermoplastic polyimide film whose precursor solution has high storage stability and which exhibits high adhesiveness even without expensive surface treatment, more specifically, a process for the production of non-thermoplastic polyimide film made of a non-thermoplastic polyimide containing a block resulting from a thermoplastic polyimide which comprises (A) the step of forming a prepolymer having amino or an acid anhydride group at the end in an organic polar solvent (B) the step of synthesizing a polyimide precursor solution by using the obtained prepolymer, an acid anhydride, and a diamine in such a way as to become substantially equimolar over the whole step, and (C) the step of casting a film-forming dope containing the polyimide precursor solution and subjecting the resultant dope to chemical and/or thermal imidization, wherein the diamine and acid dianhydride used in the step (A) are selected so that the reaction of both with each other in equimolar amounts can give a thermoplastic polyimide, and the polyimide precursor obtained in the step (B) is a precursor of a non-thermoplastic polyimide.
1. A method for producing a polyimide film containing a non-thermoplastic polyimide having a block component derived from a thermoplastic polyimide by a process at least comprising the steps of
(A) forming in an organic polar solvent a prepolymer from a diamine component (a) and an acid dianhydride component (b) in a molar amount that is less than that of the diamine component (a), the prepolymer having an amino group at one or each end;
(B) synthesizing a polyimide precursor solution from the prepolymer obtained in step (A), an acid dianhydride component (c), and a diamine component (d) in such amounts that make up equimolar amounts of acid dianhydride component and diamine component in the overall process;
(C) flow-casting a film formation dope solution containing the polyimide precursor solution and subjecting the film formation dope solution to chemical and/or thermal imidization,
wherein the diamine component (a) and the acid dianhydride component (h) used in step (A) are so selected that a polyimide prepared from equimolar reaction of the diamine component (a) and the acid dianhydride component (b) is thermoplastic, and
wherein the polyimide precursor obtained in step (B) is a precursor of the non-thermoplastic polyimide.
2. A method for producing a polyimide film containing a non-thermoplastic polyimide having a block component derived from a thermoplastic polyimide by a process at least comprising the steps of:
(A) forming in an organic polar solvent a prepolymer from a diamine component (a) and an acid dianhydride component (b) in a molar amount that is more than that of the diamine component (a), the prepolymer having an acid anhydride group at one or each end;
(B) synthesizing a non-thermoplastic polyimide precursor solution from the prepolymer obtained in step (A), an acid dianhydride component (c), and a diamine component (d) in such amounts that make up equimolar amounts of acid dianhydride component and diamine component in the overall process;
(C) flow-casting a film formation dope solution containing the non-thermoplastic polyimide precursor solution and subjecting the film formation dope solution to chemical and/or thermal imidization,
wherein the diamine component (a) and the acid dianhydride component (b) used in step (A) are so selected that a polyimide prepared from equimolar reaction of the diamine component (a) and the acid dianhydride component (b) is thermoplastic, and
wherein the polyimide precursor obtained in step (B) is a precursor of the non-thermoplastic polyimide.
3. The method as set forth in claim 1 , wherein the block component derived from the thermoplastic polyimide is contained in a range of 20 to 60 mol % with respect to the whole non-thermoplastic polyimide.
4. The method as set forth in claim 1 , wherein the diamine component (a) includes 2,2-bis (4-aminophenoxypheny)propane.
5. The method as set forth in claim 2 , wherein the diamine component (a) includes 2,2-bis (4-aminophenoxyphenyl)propane.
6. The method as set forth in claim 1 , wherein a repeating number n of the thermoplastic polyimide block is in a range of 3 to 99.
7. The method as set forth in claim 2 , wherein a repeating number n of the thermoplastic polyimide block is in a range of 3 to 99.
8. The method as set forth in claim 1 , wherein a repeating number n of the thermoplastic polyimide block is in a range of 4 to 90.
9. The method as set forth in claim 2 , wherein a repeating number n of the thermoplastic polyimide block is in a range of 4 to 90.
10. The method as set forth in claim 2 , wherein the block component derived from the thermoplastic polyimide is contained in a range of 20 to 60 mol % with respect to the whole non-thermoplastic polyimide.