Flame Retardant Resin Composition and Molded Products Thereof
A flame retardant resin composition possessing high anti-thermal characteristic, excellent anti-impact characteristic and moreover, high degree of flame retardation characteristic, comprising: a polycarbonate resin (A-1), optionally a thermoplastic resin (A-2) other than polycarbonate group resin, a phosphoric ester (B); and an alkoxy group-containing organopolysiloxane (C) expressed by the average compositional formula R 1 a Si(OR 2 ) b O (4-a-b)/2 , where R 1 is a substituted or unsubstituted univalent hydrocarbon group containing an aryl group as an essential component; R 2 is a substituted or unsubstituted univalent hydrocarbon group; R 1 and R 2 may be the same as or different from each other; 0.2≦a≦2.7; 0.2≦b≦2.4; and a+b<3.
1 - 17 . (canceled)
18 . A polycarbonate-based nonflammable resin composition, comprising:
a. 100 parts by weight of a polycarbonate-based resin;
b. 0.5 to 10 parts by weight of bisphenol A-tetrapehnyl disphosphate (BPADP); and
c. 0.05 to 10 parts by weight of an alkoxy group-containing organopolysiloxane expressed by the following average compositional formula:
R 1 a Si(OR 2 ) b O (4-a-b)/2
where R 1 is a substituted or unsubstituted univalent hydrocarbon group containing an aryl group as an essential component; R 2 is a substituted or unsubstituted univalent hydrocarbon group; R 1 and R 2 may be the same as or different from each other; 0.2<a<2.7; 0.2<b<2.4; and a+b<3.
19 . The composition of claim 18 , wherein the weight average molecular weight of the alkoxy group-containing organopolysiloxane is between 300 and 6000.
20 . The composition of claim 18 , wherein R 1 of the alkoxy group-containing organopolysiloxane (C) is a combination of methyl and/or ethyl groups and phenyl groups, and the phenyl group content is at least 20%.
21 . The composition of claim 20 , wherein from 50 to 90% of the R 1 groups are phenyl groups.
22 . The composition of claim 21 , wherein R 2 of the alkoxy group-containing organopolysiloxane (C) is a methyl group.
23 . The composition of claim 18 , wherein the alkoxy-group containing organopolysiloxane has the average compositional formula Ph 1.4 (CH 3 ) 0.3 Si(OCH 3 ) 0.8 O 0.75 wherein Ph is phenyl.
24 . The composition of claim 18 , further comprising a thermoplastic resin different from the polycarbonate-based resin.
25 . The composition of claim 24 , wherein the thermoplastic resin is ABS.
26 . The composition of claim 24 , wherein R 1 of the alkoxy group-containing organopolysiloxane (C) is a combination of methyl and/or ethyl groups and phenyl groups, and the phenyl group content is at least 20%.
27 . The composition of claim 26 , wherein from 50 to 90% of the R 1 groups are phenyl groups.
28 . The composition of claim 27 , wherein R 2 of the alkoxy group-containing organopolysiloxane (C) is a methyl group.
29 . The composition of claim 25 , wherein the alkoxy-group containing organopolysiloxane has the average compositional formula Ph 1.4 (CH 3 ) 0.3 Si(OCH 3 ) 0.8 O 0.75 wherein Ph is phenyl.
30 . The composition of claim 18 further comprising an anti-drip agent.
31 . The composition of claim 30 , wherein the anti-drip agent is polytetrafluoroethylene (PTFE).
32 . The composition of claim 31 , wherein R 1 of the alkoxy group-containing organopolysiloxane (C) is a combination of methyl and/or ethyl groups and phenyl groups, and the phenyl group content is at least 20%.
33 . The composition of claim 32 , wherein from 50 to 90% of the R 1 groups are phenyl groups.
34 . The composition of claim 33 , wherein R 2 of the alkoxy group-containing organopolysiloxane (C) is a methyl group.
35 . The composition of claim 31 , wherein the alkoxy-group containing organopolysiloxane has the average compositional formula Ph 1.4 (CH 3 ) 0.3 Si(OCH 3 ) 0.8 O 0.75 wherein Ph is phenyl.
36 . An electrical or electronic device part formed from a nonflammable resin composition as defined in claim 18 .
37 . A molded article formed from a nonflammable resin composition as defined in claim 18.