IP Library Granted Patent US 7,695,978
Granted Patent B2
US 7,695,978 · App. 11/669,448 · Granted Apr 13, 2010

MALDI target plate utilizing micro-wells

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Quick Facts
Patent No.
US 7,695,978
App. No.
11/669,448
Granted
Apr 13, 2010
Kind
B2
Abstract

An arrangement for a MALDI sample plate for ion mass spectroscopy is disclosed. The sample is configured to shape the hypersonic explosion which creates the ions generated in a MALDI-type time-of-flight mass spectrometer. The MALDI sample plate includes a glass wafer formed from a plurality of clad glass fibers and has a first planar surface. The plate also has a plurality of micro-wells formed in the glass wafer. The micro-wells extend to a depth that is less than the thickness of the glass wafer and act to hold a spot sample in a manner that prevents spreading, maximizes the formation of ions, and shapes the resulting ion cloud to improve ion migration.

Claims (13)

1. A method of making a sample support plate for use in a MALDI mass spectrometer comprising the steps of:

a. forming a multifiber billet comprising a plurality of clad glass fibers, each of the clad glass fibers comprising a soluble glass core and an insoluble glass cladding;

b. cutting a cross-sectional wafer from the multifiber billet;

c. exposing the wafer to a dissolving medium selected to dissolve the glass cores; and

d. controlling the time at which the wafer is exposed to the dissolving medium so that the glass cores are dissolved to a depth that is less than the thickness of the wafer.

2. The method of claim 1 comprising the step of rendering exposed surfaces of the wafer to be electrically conductive.

3. The method of claim 1 wherein the controlling step comprises the steps of

removing the wafer from the dissolving medium;

rinsing the wafer to remove residual dissolving medium; and then

drying the wafer.

4. The method of claim 1 wherein the dissolving medium used in step c. is an acidic solution.

5. The method of claim 1 comprising the step of applying a mask to one planar surface of the wafer so as to prevent dissolution of the glass cores on one side of the wafer.

6. The method of claim 1 wherein the step of cutting the cross-sectional wafer comprises the step of polishing the surfaces of the wafer before further processing.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS AT R/F 058808/0959 Recorded Jun 14, 2024
From: AETHER FINANCIAL SERVICES SAS, AS SECURITY AGENT
To: PHOTONIS SCIENTIFIC, INC.
Reel/Frame 067735/0264 →
SECURITY INTEREST Recorded Jan 28, 2022
From: PHOTONIS SCIENTIFIC, INC.
To: AETHER FINANCIAL SERVICES SAS, AS SECURITY AGENT
Reel/Frame 058808/0959 →
RELEASE OF INTELLECTUAL PROPERTY SECURITY INTERESTS AT R/F 048357/0067 Recorded Jan 27, 2022
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
To: BURLE TECHNOLOGIES, LLC; PHOTONIS DEFENSE, INC.; PHOTONIS SCIENTIFIC, INC.; PHOTONIS FRANCE SAS; PHOTONIS NETHERLANDS, B.V.
Reel/Frame 058887/0384 →
SECURITY INTEREST Recorded Feb 16, 2019
From: BURLE TECHNOLOGIES; PHOTONIS SCIENTIFIC, INC.; PHOTONIS NETHERLANDS B.V.; PHOTONIS FRANCE SAS
To: CREDIT SUISSE, AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 048357/0067 →
CHANGE OF NAME Recorded Nov 29, 2018
From: PHOTONIS USA, INC.
To: PHOTONIS SCIENTIFIC, INC.
Reel/Frame 047684/0477 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2018
From: BURLE TECHNOLOGIES, INC.
To: PHOTONIS USA, INC.
Reel/Frame 046305/0730 →
SECURITY AGREEMENT Recorded Sep 20, 2013
From: BURLE TECHNOLOGIES, LLC
To: CREDIT SUISSE AG AS COLLATERAL AGENT
Reel/Frame 031247/0396 →
RELEASE OF SECURITY INTEREST Recorded Sep 18, 2013
From: ING BANK N.V., LONDON BRANCH
To: BURLE TECHNOLOGIES, INC.
Reel/Frame 031235/0941 →