USE OF ORTHO-PHENYLPHENOL AND/OR DERIVATIVES THEREOF FOR INHIBITING THE ASEXUAL REPRODUCTION OF FUNGI
The use of ortho-phenylphenol and/or derivatives thereof to inhibit the asexual reproduction of fungi, and to filter media, construction materials, construction adjuvants, textiles, furs, paper, hide, or leather. Also, washing agents, cleaning agents, rinsing agents, hand washing agents, hand dishwashing agents, automatic dishwashing agents, and agents for finishing construction materials, construction adjuvants, textiles, furs, paper, hides, or leather, that contain ortho-phenylphenol and/or derivatives thereof,
1 . A method of inhibiting asexual reproduction of fungi, comprising contacting a fungus with a composition comprising a non-fungicidal, non-fungistatic, asexual reproduction inhibitive concentration of o-phenylphenol or a derivative thereof.
2 . The method of claim 1 , wherein the o-phenylphenol or derivative thereof is bound in a carrier molecule.
3 . The method of claim 1 , wherein the carrier molecule comprises a clathrate molecule.
4 . The method of claim 1 , wherein the derivative of o-phenylphenol comprises an ester or ether thereof.
5 . The method of claim 1 , wherein the fungus is human-pathenogenic.
6 . The method of claim 1 , wherein the fungus is selected from the group consisting of the classes Ascomycota, Basidiomycota, Deuteromycota, and Zygomycota, the genera Aspergillus, Penicillium, Cladosporium, and Mucor, and all human-pathenogenic forms of Candida.
7 . The method of claim 6 , wherein the fungus is selected from the group consisting of Aspergillus aculeatus, Aspergillus albus, Aspergillus alliaceus, Aspergillus asperescens, Aspergillus awamori, Aspergillus candidus, Aspergillus carbonarius, Aspergillus carneus, Aspergillus chevalieri, Aspergillus chevalieri var. intermedius, Aspergillus clavatus, Aspergillus ficuum, Aspergillus flavipes, Aspergillus flavus, Aspergillus foetidus, Aspergillus fumigatus, Aspergillus giganteus, Aspergillus humicola, Aspergillus intermedius, Aspergillus japonicus, Aspergillus nidulans, Aspergillus niger, Aspergillus niveus, Aspergillus ochraceus, Aspergillus oryzae, Aspergillus ostianus, Aspergillus parasiticus, Aspergillus parasiticus var. globosus, Aspergillus penicilloides, Aspergillus phoenicis, Aspergillus rugulosus, Aspergillus sclerotiorum, Aspergillus sojae var. gymnosardae, Aspergillus sydowi, Aspergillus tamarii, Aspergillus terreus, Aspergillus terricola, Aspergillus toxicarius, Aspergillus unguis, Aspergillus ustus, Aspergillus versicolor, Aspergillus vitricolae and Aspergillus wentii.
8 . The method of claim 1 , wherein the composition further comprises at least one substance other than the o-phenylphenol or derivative thereof, said substance comprising a biocide present in the composition in a fungicidal concentration.
9 . The method of claim 1 , wherein the composition comprises 0.000001% to 2% by weight of ophenylphenol or a derivative thereof.
10 . The method of claim 9 , wherein the composition comprises 0.00001% to 1% by weight of o-phenylphenol or a derivative thereof.
11 . The method of claim 10 , wherein the composition comprises 0.00001% to 0.1% by weight of ophenylphenol or a derivative thereof.
12 . The method of claim 11 , wherein the composition comprises 0.00005% to 0,05% by weight of o-phenylphenol or a derivative thereof.
13 . The method of claim 12 , wherein the composition comprises 0.00005% to 0.0005% by weight of o-phenyiphenol or a derivative thereof.
14 . The method of claim 10 , wherein the composition comprises 0.001% to 1% by weight of o-phenylphenol or a derivative thereof.
15 . The method of claim 14 , wherein the composition comprises 0.001% to 0.1% by weight of o-phenylphenol or a derivative thereof.
16 . The method of claim 1 , wherein the fungus is present on a material selected from the group consisting of textiles, ceramics, metals, filter media, construction materials, construction adjuvants, furs, paper, hides, leather, and plastics.
17 . A sealing compound comprising one or more acrylate or urethane polymers, one or more organic or inorganic fillers, and 0.000001% to 2% by weight of o-phenylphenol or a derivative thereof.
18 . The sealing compound of claim 17 , further comprising at least one other biocidal substance present in a fungicidal concentration.
19 . An adhesive composition comprising at least one adhesive compound and 0.000001% to 2% by weight of o-phenylphenol or a derivative thereof.
20 . The composition of claim 19 , wherein the adhesive compound is water-soluble.